Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 83 - Original source of goods

Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
ICO-486-S8A-T CONN IC DIP SOCKET 48POS TIN 3M	-	RFQ	Datasheet	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-486-S8-T CONN IC DIP SOCKET 48POS TIN 3M	-	RFQ	Datasheet	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
AR08-HZL-TT CONN IC DIP SOCKET 8POS TIN Assmann WSW Components	-	RFQ	Datasheet	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
AW 127-04/Z-T SOCKET 4 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SIP1X05-011B SIP1X05-011B-SIP SOCKET 5 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP1x	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
115-87-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	-	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AW 127-09/Z-T SOCKET 9 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
DIP308-014B DIP SOCKET 8 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	-	Bag	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
114-87-304-41-117101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	Datasheet	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
ICO-426-S8A-T CONN IC DIP SOCKET 42POS TIN 3M	-	RFQ	Datasheet	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-426-S8-T CONN IC DIP SOCKET 42POS TIN 3M	-	RFQ	Datasheet	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
AR 06 HGL-TT SOCKET Assmann WSW Components	-	RFQ	Datasheet	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
DIP308-011B DIP SOCKET 8 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	-	Bag	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
SIP1X06-014B SIP1X06-014B-SIP SOCKET 6 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP1x	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Tin-Lead	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
WMS-080Z CONN IC DIP SOCKET 8POS GOLD On Shore Technology Inc.	-	RFQ	Datasheet	WMS	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-40°C ~ 105°C
DIP306-001B SOCKET 6 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	-	Bag	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
01-0513-10 CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	Datasheet	0513	Bulk	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
01-0513-10T CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	Datasheet	0513	Bulk	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
01-0518-10 CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	Datasheet	518	Bulk	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
SIP050-1X03-157B 1X03-157B-SIP SOCKET 3 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP050-1x	Bulk	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-

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