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Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
299-43-612-10-002000

299-43-612-10-002000

CONN IC DIP SOCKET 12POS GOLD

Mill-Max Manufacturing Corp.

 15
RFQ
299-43-612-10-002000

Datasheet

 		299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-320-11-001000

299-93-320-11-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

 24
RFQ
299-93-320-11-001000

Datasheet

 		299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-43-108-41-005000

317-43-108-41-005000

CONN SOCKET 8POS .070 STR GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
317-43-108-41-005000

Datasheet

 		317 Tube Active SIP 8 (1 x 8) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-6574-10

24-6574-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

 0
RFQ
24-6574-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
80-PGM15059-10

80-PGM15059-10

CONN SOCKET PGA GOLD

Aries Electronics

 0
RFQ
80-PGM15059-10

Datasheet

 		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6574-10

28-6574-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 0
RFQ
28-6574-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-6574-10

40-6574-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 0
RFQ
40-6574-10

Datasheet

 		57 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
AR 32-HZL-TT

AR 32-HZL-TT

CONN IC DIP SOCKET 32POS TIN

Assmann WSW Components

 0
RFQ
AR 32-HZL-TT

Datasheet

 		- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-83-308-41-105101

110-83-308-41-105101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

 0
RFQ
110-83-308-41-105101

Datasheet

 		110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
XR2A-4011-N

XR2A-4011-N

CONN IC DIP SOCKET 40POS GOLD

Omron Electronics Inc-EMC Div

 8
RFQ
XR2A-4011-N

Datasheet

 		XR2 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
110-44-304-41-001000

110-44-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 22
RFQ
110-44-304-41-001000

Datasheet

 		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-99-306-41-001000

110-99-306-41-001000

CONN IC DIP SOCKET 6POS TIN-LEAD

Mill-Max Manufacturing Corp.

 4
RFQ
110-99-306-41-001000

Datasheet

 		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-306-41-001000

110-93-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
110-93-306-41-001000

Datasheet

 		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-13-308-41-001000

210-13-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

 4
RFQ
210-13-308-41-001000

Datasheet

 		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AW 127-02/Z-T

AW 127-02/Z-T

SOCKET 2 CONTACTS SINGLE ROW

Assmann WSW Components

 0
RFQ
AW 127-02/Z-T

Datasheet

 		- - Active - - - - - - - - - - - - - - -
390261-2

390261-2

CONN IC DIP SOCKET 8POS TIN-LEAD

TE Connectivity AMP Connectors

 0
RFQ
390261-2

Datasheet

 		- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze - -40°C ~ 105°C
ICO-163-S8A-T

ICO-163-S8A-T

CONN IC DIP SOCKET 16POS TIN

3M

 0
RFQ
ICO-163-S8A-T

Datasheet

 		ICO Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
ICO-143-S8A-T

ICO-143-S8A-T

CONN IC DIP SOCKET 14POS TIN

3M

 0
RFQ
ICO-143-S8A-T

Datasheet

 		ICO Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
ICO-143-S8-T

ICO-143-S8-T

CONN IC DIP SOCKET 14POS TIN

3M

 0
RFQ
ICO-143-S8-T

Datasheet

 		ICO Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
390261-4

390261-4

CONN IC DIP SOCKET 16POS TINLEAD

TE Connectivity AMP Connectors

 0
RFQ
390261-4

Datasheet

 		- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze - -40°C ~ 105°C
Total 19086 Record«Prev1... 7677787980818283...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
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In-stock Warehouse
15,000+ In-stock Warehouse
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