Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 82 - Original source of goods

Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
1-390261-7 CONN IC DIP SOCKET 22POS TIN TE Connectivity AMP Connectors	-	RFQ	Datasheet	-	Box	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	-	-40°C ~ 105°C
AW 127-07/Z-T SOCKET 7 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
ICO-406-S8A-T CONN IC DIP SOCKET 40POS TIN 3M	-	RFQ	Datasheet	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
ICO-406-S8-T CONN IC DIP SOCKET 40POS TIN 3M	-	RFQ	Datasheet	ICO	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polyester, Glass Filled	-65°C ~ 105°C
390262-2 CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	-	RFQ	Datasheet	-	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole, Right Angle, Vertical	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	-	-40°C ~ 105°C
4828-3000-CP CONN IC DIP SOCKET 28POS TIN 3M	-	RFQ	Datasheet	4800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
A06-LCG-T CONN IC DIP SOCKET 6POS GOLD Assmann WSW Components	-	RFQ	-	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	-	-	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
SIP050-1X02-157B 1X02-157B-SIP SOCKET 2 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP050-1x	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
A08-LCG CONN IC DIP SOCKET 8POS GOLD Assmann WSW Components	-	RFQ	-	-	-	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	-	-	-	-
390263-7 CONN IC DIP SOCKET 24POS TINLEAD TE Connectivity AMP Connectors	-	RFQ	Datasheet	-	Box	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Phosphor Bronze	-	-40°C ~ 105°C
110-87-304-41-005101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	Datasheet	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SIP1X05-014B SIP1X05-014B-SIP SOCKET 5 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP1x	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Tin-Lead	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X04-014B SIP1X04-014B-SIP SOCKET 4 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP1x	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Tin-Lead	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X04-011B SIP1X04-011B-SIP SOCKET 4 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP1x	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
WMS-060Z CONN IC DIP SOCKET 6POS GOLD On Shore Technology Inc.	-	RFQ	Datasheet	WMS	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-40°C ~ 105°C
XR2C-2000-HSG CONN IC SOCKET 20POS Omron Electronics Inc-EMC Div	-	RFQ	Datasheet	XR2	Bulk	Obsolete	Housing	20 (1 x 20)	0.100" (2.54mm)	-	-	Beryllium Copper	-	Closed Frame	Solder	0.100" (2.54mm)	-	-	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
A22-LC-TR CONN IC DIP SOCKET 22POS TIN Assmann WSW Components	-	RFQ	-	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
AR 10-HZL-TT CONN IC DIP SOCKET 10POS GOLD Assmann WSW Components	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
AW 127-08/Z-T SOCKET 8 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SIP050-1X02-160B 1X02-160B-SIP SOCKET 2 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP050-1x	Bulk	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-

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