IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
AR16-HZL-TT

AR16-HZL-TT

CONN IC DIP SOCKET 16POS TIN

Assmann WSW Components

0
RFQ
AR16-HZL-TT

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A48-LC-TR

A48-LC-TR

CONN IC DIP SOCKET 48POS TIN

Assmann WSW Components

0
RFQ
A48-LC-TR

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
AW 127-15/Z-T

AW 127-15/Z-T

SOCKET 15 CONTACTS SINGLE ROW

Assmann WSW Components

0
RFQ
AW 127-15/Z-T

Datasheet

- - Active - - - - - - - - - - - - - - -
116-87-304-41-003101

116-87-304-41-003101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0
RFQ
116-87-304-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-304-41-117101

114-83-304-41-117101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0
RFQ
114-83-304-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A 42-LC-TR

A 42-LC-TR

SOCKET

Assmann WSW Components

0
RFQ

-

A Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
114-87-306-41-117101

114-87-306-41-117101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0
RFQ
114-87-306-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-306-41-134161

114-87-306-41-134161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0
RFQ
114-87-306-41-134161

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X08-011B

SIP1X08-011B

SIP1X08-011B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

0
RFQ
SIP1X08-011B

Datasheet

SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
110-83-304-41-005101

110-83-304-41-005101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0
RFQ
110-83-304-41-005101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
01-0513-11

01-0513-11

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0
RFQ
01-0513-11

Datasheet

0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-1518-00

02-1518-00

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0
RFQ
02-1518-00

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
115-87-306-41-001101

115-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 22-HZL-TT

AR 22-HZL-TT

SOCKET

Assmann WSW Components

0
RFQ

-

- Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
AW 127-16/Z-T

AW 127-16/Z-T

SOCKET 16 CONTACTS SINGLE ROW

Assmann WSW Components

0
RFQ
AW 127-16/Z-T

Datasheet

- - Active - - - - - - - - - - - - - - -
AR08-HZL/07-TT

AR08-HZL/07-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

0
RFQ
AR08-HZL/07-TT

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
HLS-0101-T-10

HLS-0101-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0101-T-10

Datasheet

HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
SA1000300000G

SA1000300000G

SA-7.43- 10P ; CLIP:TIN200U" PI

Amphenol Anytek

0
RFQ

-

SU Bulk Active SIP 10 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
02-0518-10H

02-0518-10H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0
RFQ
02-0518-10H

Datasheet

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0518-10T

02-0518-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0
RFQ
02-0518-10T

Datasheet

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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