Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 85 - Original source of goods

Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
AW 127-13/Z-T SOCKET 13 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SIP1X07-014B SIP1X07-014B-SIP SOCKET 7 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP1x	Bulk	Active	SIP	7 (1 x 7)	0.100" (2.54mm)	Tin-Lead	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
SIP1X06-001B SIP1X06-001B-SIP SOCKET 6 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP1x	Bulk	Active	SIP	6 (1 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
116-87-304-41-006101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	Datasheet	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
232-20 CONN SOCKET PLCC 20POS TIN CNC Tech	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
02-1518-10 CONN IC DIP SOCKET 2POS GOLD Aries Electronics	-	RFQ	Datasheet	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	2 (1 x 2)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
SIP41430-001LF CONN SOCKET SIP 2POS TIN Amphenol ICC (FCI)	-	RFQ	Datasheet	-	Tape & Reel (TR)	Obsolete	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyamide (PA), Nylon	-
A 28-LC/7-T CONN IC DIP SOCKET 28POS TIN Assmann WSW Components	-	RFQ	Datasheet	-	Box	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
232-32 CONN SOCKET PLCC 32POS TIN CNC Tech	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	32 (4 x 8)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
AW 127-14/Z-T SOCKET 14 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
SIP050-1X04-157B 1X04-157B-SIP SOCKET 4 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP050-1x	Bulk	Active	SIP	4 (1 x 4)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
116-87-304-41-018101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	Datasheet	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SIP1X07-011B SIP1X07-011B-SIP SOCKET 7 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP1x	Bulk	Active	SIP	7 (1 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
115-83-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	-	115	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR06-HZL/07-TT CONN IC DIP SOCKET 6POS GOLD Assmann WSW Components	-	RFQ	Datasheet	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
232-28 CONN SOCKET PLCC 28POS TIN CNC Tech	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	28 (4 x 7)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
A16-LCG CONN IC DIP SOCKET 16POS GOLD Assmann WSW Components	-	RFQ	-	-	-	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	-	-	-	-
AR08-HZL/01-TT CONN IC DIP SOCKET 8POS GOLD Assmann WSW Components	-	RFQ	Datasheet	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
HLS-0101-T-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	Datasheet	HLS	Tube	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
614-87-304-31-012101 CONN IC DIP SOCKET 320POS GOLD Preci-Dip	-	RFQ	Datasheet	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	320 (19 x 19)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C

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