IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
220-2600-50-0602

220-2600-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 220

3M

0
RFQ

-

Textool™ Box Active SIP, ZIF (ZIP) 20 (1 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
518-77-256M16-000105

518-77-256M16-000105

CONN SOCKET PGA 256POS GOLD

Preci-Dip

0
RFQ
518-77-256M16-000105

Datasheet

518 Bulk Active PGA 256 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-256M20-001105

518-77-256M20-001105

CONN SOCKET PGA 256POS GOLD

Preci-Dip

0
RFQ
518-77-256M20-001105

Datasheet

518 Bulk Active PGA 256 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
514-87-400M20-000148

514-87-400M20-000148

CONN SOCKET BGA 400POS GOLD

Preci-Dip

0
RFQ
514-87-400M20-000148

Datasheet

514 Bulk Active BGA 400 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-10-292M20-001152

550-10-292M20-001152

BGA SOLDER TAIL

Preci-Dip

0
RFQ
550-10-292M20-001152

Datasheet

550 Bulk Active BGA 292 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-1136-G-R

APH-1136-G-R

APH-1136-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1236-G-R

APH-1236-G-R

APH-1236-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1736-G-R

APH-1736-G-R

APH-1736-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1336-G-R

APH-1336-G-R

APH-1336-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
550-10-420M26-001166

550-10-420M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0
RFQ
550-10-420M26-001166

Datasheet

550 Bulk Active BGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
2100-7243-00-1807

2100-7243-00-1807

CONN SOCKET PQFP 100POS TIN-LEAD

3M

0
RFQ
2100-7243-00-1807

Datasheet

OEM Bulk Obsolete QFP 100 (4 x 25) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Polyethersulfone (PES), Glass Filled 0°C ~ 105°C
614-87-296-19-131144

614-87-296-19-131144

CONN SOCKET PGA 296POS GOLD

Preci-Dip

0
RFQ
614-87-296-19-131144

Datasheet

614 Bulk Active PGA 296 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-447-20-121147

546-87-447-20-121147

CONN SOCKET PGA 447POS GOLD

Preci-Dip

0
RFQ
546-87-447-20-121147

Datasheet

546 Bulk Active PGA 447 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-77-255M16-001106

518-77-255M16-001106

CONN SOCKET PGA 255POS GOLD

Preci-Dip

0
RFQ
518-77-255M16-001106

Datasheet

518 Bulk Active PGA 255 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
239-5605-02-0602

239-5605-02-0602

CONN ZIG-ZAG 39POS GOLD

3M

0
RFQ
239-5605-02-0602

Datasheet

- Bulk Obsolete Zig-Zag 39 (1 x 19, 1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 150°C
510-91-324-18-000001

510-91-324-18-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
510-91-324-18-000001

Datasheet

510 Bulk Active PGA 324 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
518-77-256M16-000106

518-77-256M16-000106

CONN SOCKET PGA 256POS GOLD

Preci-Dip

0
RFQ
518-77-256M16-000106

Datasheet

518 Bulk Active PGA 256 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-256M20-001106

518-77-256M20-001106

CONN SOCKET PGA 256POS GOLD

Preci-Dip

0
RFQ
518-77-256M20-001106

Datasheet

518 Bulk Active PGA 256 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
64-9503-21

64-9503-21

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

0
RFQ
64-9503-21

Datasheet

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
64-9503-31

64-9503-31

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

0
RFQ
64-9503-31

Datasheet

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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