IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
24-3570-16

24-3570-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-3570-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
24-3571-16

24-3571-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-3571-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
APH-1434-G-H

APH-1434-G-H

APH-1434-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0534-G-H

APH-0534-G-H

APH-0534-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0934-G-H

APH-0934-G-H

APH-0934-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1934-G-H

APH-1934-G-H

APH-1934-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1134-G-H

APH-1134-G-H

APH-1134-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0634-G-H

APH-0634-G-H

APH-0634-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1634-G-H

APH-1634-G-H

APH-1634-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0334-G-H

APH-0334-G-H

APH-0334-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1734-G-H

APH-1734-G-H

APH-1734-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1334-G-H

APH-1334-G-H

APH-1334-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
546-83-325-18-111147

546-83-325-18-111147

CONN SOCKET PGA 325POS GOLD

Preci-Dip

0
RFQ
546-83-325-18-111147

Datasheet

546 Bulk Active PGA 325 (18 x 18) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-255M16-001101

558-10-255M16-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0
RFQ
558-10-255M16-001101

Datasheet

558 Bulk Active PGA 255 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-10-388M26-001166

550-10-388M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0
RFQ
550-10-388M26-001166

Datasheet

550 Bulk Active BGA 388 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
32-6556-40

32-6556-40

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0
RFQ
32-6556-40

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
558-10-256M20-001101

558-10-256M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0
RFQ
558-10-256M20-001101

Datasheet

558 Bulk Active PGA 256 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-256M16-000101

558-10-256M16-000101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0
RFQ
558-10-256M16-000101

Datasheet

558 Bulk Active PGA 256 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-10-272M20-001152

550-10-272M20-001152

BGA SOLDER TAIL

Preci-Dip

0
RFQ
550-10-272M20-001152

Datasheet

550 Bulk Active BGA 272 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-0936-G-T

APH-0936-G-T

APH-0936-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
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