IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1140-G-H

APH-1140-G-H

APH-1140-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
24-6570-16

24-6570-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-6570-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
24-6571-16

24-6571-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-6571-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
24-6573-16

24-6573-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-6573-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
546-83-364-17-091147

546-83-364-17-091147

CONN SOCKET PGA 364POS GOLD

Preci-Dip

0
RFQ
546-83-364-17-091147

Datasheet

546 Bulk Active PGA 364 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
24-3575-16

24-3575-16

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-3575-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6575-16

24-6575-16

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-6575-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
HLS-0420-G-19

HLS-0420-G-19

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0420-G-19

Datasheet

HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-93-299-20-096002

510-93-299-20-096002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
510-93-299-20-096002

Datasheet

510 Tube Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
518-77-272M20-001106

518-77-272M20-001106

CONN SOCKET PGA 272POS GOLD

Preci-Dip

0
RFQ
518-77-272M20-001106

Datasheet

518 Bulk Active PGA 272 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
546-83-365-14-000147

546-83-365-14-000147

CONN SOCKET PGA 365POS GOLD

Preci-Dip

0
RFQ
546-83-365-14-000147

Datasheet

546 Bulk Active PGA 365 (14 x 14) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-365-17-091147

546-83-365-17-091147

CONN SOCKET PGA 365POS GOLD

Preci-Dip

0
RFQ
546-83-365-17-091147

Datasheet

546 Bulk Active PGA 365 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-87-432M31-001148

514-87-432M31-001148

CONN SOCKET BGA 432POS GOLD

Preci-Dip

0
RFQ
514-87-432M31-001148

Datasheet

514 Bulk Active BGA 432 (31 x 31) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
48-6508-21

48-6508-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0
RFQ
48-6508-21

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
48-6508-31

48-6508-31

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0
RFQ
48-6508-31

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-3551-16

24-3551-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-3551-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-3552-16

24-3552-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-3552-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6551-16

24-6551-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-6551-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6552-16

24-6552-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-6552-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-3553-16

24-3553-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-3553-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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