IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APA-648-G-Q

APA-648-G-Q

ADAPTER PLUG

Samtec Inc.

0
RFQ
APA-648-G-Q

Datasheet

APA Tube Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
514-87-420M26-001148

514-87-420M26-001148

CONN SOCKET BGA 420POS GOLD

Preci-Dip

0
RFQ
514-87-420M26-001148

Datasheet

514 Bulk Active BGA 420 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-272M20-001104

558-10-272M20-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0
RFQ
558-10-272M20-001104

Datasheet

558 Bulk Active BGA 272 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-1438-G-R

APH-1438-G-R

APH-1438-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0538-G-R

APH-0538-G-R

APH-0538-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1538-G-R

APH-1538-G-R

APH-1538-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0638-G-R

APH-0638-G-R

APH-0638-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1638-G-R

APH-1638-G-R

APH-1638-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1138-G-R

APH-1138-G-R

APH-1138-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0338-G-R

APH-0338-G-R

APH-0338-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
518-77-272M20-001105

518-77-272M20-001105

CONN SOCKET PGA 272POS GOLD

Preci-Dip

0
RFQ
518-77-272M20-001105

Datasheet

518 Bulk Active PGA 272 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
24-6572-16

24-6572-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0
RFQ
24-6572-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
24-6574-16

24-6574-16

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0
RFQ
24-6574-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
558-10-292M20-001101

558-10-292M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0
RFQ
558-10-292M20-001101

Datasheet

558 Bulk Active PGA 292 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-1340-G-H

APH-1340-G-H

APH-1340-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1840-G-H

APH-1840-G-H

APH-1840-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0940-G-H

APH-0940-G-H

APH-0940-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1540-G-H

APH-1540-G-H

APH-1540-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1040-G-H

APH-1040-G-H

APH-1040-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1740-G-H

APH-1740-G-H

APH-1740-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
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