IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
32-6551-16

32-6551-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0
RFQ
32-6551-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
223-83-964-41-101000

223-83-964-41-101000

SKT IC CLOSED

Mill-Max Manufacturing Corp.

0
RFQ
223-83-964-41-101000

Datasheet

223 Bulk Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
518-77-360M19-001106

518-77-360M19-001106

CONN SOCKET PGA 360POS GOLD

Preci-Dip

0
RFQ
518-77-360M19-001106

Datasheet

518 Bulk Active PGA 360 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
36-6572-16

36-6572-16

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

0
RFQ
36-6572-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
290-1294-00-3302J

290-1294-00-3302J

CONN IC DIP SOCKET ZIF 90POS GLD

3M

0
RFQ
290-1294-00-3302J

Datasheet

Textool™ Bulk Active DIP, ZIF (ZIP) 90 (2 x 45) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
110-33-640-41-530000

110-33-640-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
110-33-640-41-530000

Datasheet

110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-33-640-41-101000

210-33-640-41-101000

SOCKET IC CLOSED FRM .600 28POS

Mill-Max Manufacturing Corp.

0
RFQ

-

210 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-10-600M35-001166

550-10-600M35-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0
RFQ
550-10-600M35-001166

Datasheet

550 Bulk Active BGA 600 (35 x 35) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
514-87-576M30-001148

514-87-576M30-001148

CONN SOCKET BGA 576POS GOLD

Preci-Dip

0
RFQ
514-87-576M30-001148

Datasheet

514 Bulk Active BGA 576 (30 x 30) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
48-6556-41

48-6556-41

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0
RFQ
48-6556-41

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
550-10-420M26-001152

550-10-420M26-001152

BGA SOLDER TAIL

Preci-Dip

0
RFQ
550-10-420M26-001152

Datasheet

550 Bulk Active BGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
40-6554-16

40-6554-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

0
RFQ
40-6554-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-3553-16

40-3553-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

0
RFQ
40-3553-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
64-9508-21

64-9508-21

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

0
RFQ
64-9508-21

Datasheet

508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
64-9508-31

64-9508-31

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

0
RFQ
64-9508-31

Datasheet

508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
169-PGM13001-51

169-PGM13001-51

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
169-PGM13001-51

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
558-10-400M20-000101

558-10-400M20-000101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0
RFQ
558-10-400M20-000101

Datasheet

558 Bulk Active PGA 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
36-3570-16

36-3570-16

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

0
RFQ
36-3570-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
210-33-314-41-001000

210-33-314-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0
RFQ
210-33-314-41-001000

Datasheet

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
514-83-456M26-001148

514-83-456M26-001148

CONN SOCKET BGA 456POS GOLD

Preci-Dip

0
RFQ
514-83-456M26-001148

Datasheet

514 Bulk Active BGA 456 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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