IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
180-PGM18007-41

180-PGM18007-41

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
180-PGM18007-41

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
510-13-223-18-095001

510-13-223-18-095001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
510-13-223-18-095001

Datasheet

510 Bulk Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-83-628-41-001000

210-83-628-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0
RFQ
210-83-628-41-001000

Datasheet

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
110-83-628-41-001000

110-83-628-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0
RFQ

-

- Tube Active - - - - - - - - - - - - - - -
510-13-224-18-095002

510-13-224-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
510-13-224-18-095002

Datasheet

510 Tube Active PGA 224 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-33-316-41-530000

110-33-316-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
110-33-316-41-530000

Datasheet

110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-83-325-18-111144

614-83-325-18-111144

CONN SOCKET PGA 325POS GOLD

Preci-Dip

0
RFQ
614-83-325-18-111144

Datasheet

614 Bulk Active PGA 325 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
210-83-632-41-001000

210-83-632-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0
RFQ

-

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
550-10-388M26-001152

550-10-388M26-001152

BGA SOLDER TAIL

Preci-Dip

0
RFQ
550-10-388M26-001152

Datasheet

550 Bulk Active BGA 388 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
546-83-447-20-121147

546-83-447-20-121147

CONN SOCKET PGA 447POS GOLD

Preci-Dip

0
RFQ
546-83-447-20-121147

Datasheet

546 Bulk Active PGA 447 (20 x 20) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
132-PGM13079-10H

132-PGM13079-10H

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
132-PGM13079-10H

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
132-PGM14015-10H

132-PGM14015-10H

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
132-PGM14015-10H

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
210-33-320-41-101000

210-33-320-41-101000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
210-33-320-41-101000

Datasheet

210 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
36-6556-41

36-6556-41

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0
RFQ
36-6556-41

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
550-10-560M33-001166

550-10-560M33-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0
RFQ
550-10-560M33-001166

Datasheet

550 Bulk Active BGA 560 (33 x 33) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
110-33-624-41-530000

110-33-624-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
110-33-624-41-530000

Datasheet

110 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
133-PGM13052-10H

133-PGM13052-10H

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
133-PGM13052-10H

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
133-PGM13067-10H

133-PGM13067-10H

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
133-PGM13067-10H

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
133-PGM14013-10H

133-PGM14013-10H

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
133-PGM14013-10H

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
210-83-640-41-001000

210-83-640-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0
RFQ
210-83-640-41-001000

Datasheet

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Thermoplastic -55°C ~ 125°C
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