Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 889 - Original source of goods

Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
110-83-640-41-001000 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	-	RFQ	-	-	Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
100-PRS10001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	-	RFQ	Datasheet	PRS	Bulk	Active	PGA, ZIF (ZIP)	-	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)	-65°C ~ 125°C
40-6556-40 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	-	RFQ	Datasheet	6556	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
514-83-420M26-001148 CONN SOCKET BGA 420POS GOLD Preci-Dip	-	RFQ	Datasheet	514	Bulk	Active	BGA	420 (26 x 26)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
550-10-381-18-101135 PGA SOLDER TAIL Preci-Dip	-	RFQ	Datasheet	550	Bulk	Active	PGA	381 (18 x 18)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0520-T-18 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	Datasheet	HLS	Bulk	Active	SIP	100 (5 x 20)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
614-83-320-19-131144 CONN SOCKET PGA 320POS GOLD Preci-Dip	-	RFQ	Datasheet	614	Bulk	Active	PGA	320 (19 x 19)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
558-10-352M26-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	-	RFQ	Datasheet	558	Bulk	Active	BGA	352 (26 x 26)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
132-PGM13038-50 CONN SOCKET PGA GOLD Aries Electronics	-	RFQ	-	PGM	-	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
614-83-321-19-121144 CONN SOCKET PGA 321POS GOLD Preci-Dip	-	RFQ	Datasheet	614	Bulk	Active	PGA	321 (21 x 21)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
518-77-352M26-001105 CONN SOCKET PGA 352POS GOLD Preci-Dip	-	RFQ	Datasheet	518	Bulk	Active	PGA	352 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
110-33-314-41-001000 STANDRD SOLDER TAIL DIP SOCKET Mill-Max Manufacturing Corp.	-	RFQ	-	-	Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
44-536-11 CONN SOCKET PLCC ZIF 44POS GOLD Aries Electronics	-	RFQ	-	536	-	Obsolete	PLCC, ZIF (ZIP)	44 (4 x 11)	0.050" (1.27mm)	Gold	12.0µin (0.30µm)	-	Through Hole	Open Frame	-	-	-	-	-	-	-
32-3574-16 CONN IC DIP SOCKET ZIF 32POS Aries Electronics	-	RFQ	Datasheet	57	Bulk	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Nickel	Polyphenylene Sulfide (PPS), Glass Filled	-
558-10-356M26-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	-	RFQ	Datasheet	558	Bulk	Active	BGA	356 (26 x 26)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-400M20-000152 BGA SOLDER TAIL Preci-Dip	-	RFQ	Datasheet	550	Bulk	Active	BGA	400 (20 x 20)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
546-83-463-19-101147 CONN SOCKET PGA 463POS GOLD Preci-Dip	-	RFQ	Datasheet	546	Bulk	Active	PGA	463 (19 x 19)	0.050" (1.27mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100" (2.54mm)	Tin	-	Bronze	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
558-10-357M19-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	-	RFQ	Datasheet	558	Bulk	Active	BGA	357 (19 x 19)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
550-10-576M30-001166 BGA PIN ADAPTER 1.27MM SMD Preci-Dip	-	RFQ	Datasheet	550	Bulk	Active	BGA	576 (30 x 30)	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass	-55°C ~ 125°C
518-77-356M26-001105 CONN SOCKET PGA 356POS GOLD Preci-Dip	-	RFQ	Datasheet	518	Bulk	Active	PGA	356 (26 x 26)	0.050" (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050" (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass	-55°C ~ 125°C

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