Solder

制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





















































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
SMDLTLFP

SMDLTLFP

SOLDER PASTE LOW TEMP 5CC W/TIP

Chip Quik Inc.

98
RFQ
SMDLTLFP

Datasheet

- Dispenser Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 3 Lead Free Syringe, 0.53 oz (15g), 5cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
TS391AX

TS391AX

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

41
RFQ
TS391AX

Datasheet

- Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMD291SNL

SMD291SNL

SOLDER PASTE NO-CLEAN LF 5CC SYR

Chip Quik Inc.

37
RFQ
SMD291SNL

Datasheet

- Dispenser Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Syringe, 0.53 oz (15g), 5cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
TS391LT

TS391LT

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

87
RFQ
TS391LT

Datasheet

- Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMD291SNL50T3

SMD291SNL50T3

SLDR PASTE NO-CLN SAC305 50G

Chip Quik Inc.

58
RFQ
SMD291SNL50T3

Datasheet

- Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Jar, 1.76 oz (50g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
TS391SNL

TS391SNL

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

35
RFQ
TS391SNL

Datasheet

- Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
TS391SNL50

TS391SNL50

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

60
RFQ
TS391SNL50

Datasheet

- Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 1.76 oz (50g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMDSWLF.031 2OZ

SMDSWLF.031 2OZ

SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.

Chip Quik Inc.

92
RFQ
SMDSWLF.031 2OZ

Datasheet

- Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 20 AWG, 22 SWG - Lead Free Spool, 2 oz (56.70g) - - -
SMDIN97AG3

SMDIN97AG3

INDIUM SOLDER WIRE (IN97/AG3) 0.

Chip Quik Inc.

69
RFQ
SMDIN97AG3

Datasheet

SMD Bulk Active Wire Solder In97Ag3 (97/3) 0.031" (0.79mm) 289°F (143°C) - 20 AWG, 21 SWG - Lead Free Spool 24 Months Date of Manufacture -
SMD291AX10

SMD291AX10

SOLDER PASTE NO-CLEAN 63/37 10CC

Chip Quik Inc.

39
RFQ
SMD291AX10

Datasheet

- Dispenser Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 3 Leaded Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
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