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Solder
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Composition | Diameter | Melting Point | Flux Type | Wire Gauge | Mesh Type | Process | Form | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NCSWLF.031 0.5OZLF SOLDER WIRE MINI POCKET PACK Chip Quik Inc. |
298 |
|
Datasheet |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | 20 AWG, 21 SWG | - | - | Tube, 0.50 oz (14.17g) | - | - | - |
|
SMD291AX250T4SLDR PST NO-CLEAN 63/37 T4 250G Chip Quik Inc. |
26 |
|
Datasheet |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2165SOLDER SPHERES 63/37 .012 DIAM Chip Quik Inc. |
46 |
|
Datasheet |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.012" (0.31mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
WW100GE.031 1LBGERMANIUM DOPED SOLDER WIRE SN/C Chip Quik Inc. |
35 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | - |
|
|
EXB-SN96.5AG3.5SOLDER BAR SN96.5/AG3.5 1LB (454 Chip Quik Inc. |
45 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Bar Solder | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | - | - | - | Leaded | Bar, 1 lb (453.59g) | - | - | - |
|
|
WW100GE.020 1LBGERMANIUM DOPED SOLDER WIRE SN/C Chip Quik Inc. |
36 |
|
Datasheet |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | - | - | - | Spool | 60 Months | - | - |
|
NC191LT10SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
81 |
|
Datasheet |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.35 oz (10g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LTA10SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
73 |
|
Datasheet |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Syringe, 0.35 oz (10g), 3cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
EXB-SN63PB37-0.5LBSOLDER BAR SN63/PB37 0.5LB (227G Chip Quik Inc. |
99 |
|
Datasheet |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 0.5 lb (227g) | - | - | - |
|
SMD291AXSOLDER PASTE NO-CLEAN 63/37 5CC Chip Quik Inc. |
61 |
|
Datasheet |
- | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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