Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 98 - Original source of goods

Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
AW 127-28/Z-T SOCKET 28 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
232-68 CONN SOCKET PLCC 68POS TIN CNC Tech	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
SIP1X16-014B SIP1X16-014B-SIP SOCKET 16 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP1x	Bulk	Active	SIP	16 (1 x 16)	0.100" (2.54mm)	Tin-Lead	150.0µin (3.81µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-
A-CCS28-Z-SM-R CONN SOCKET PLCC 28POS TIN Assmann WSW Components	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	28 (4 x 7)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
A-CCS44-Z CONN SOCKET PLCC 44POS TIN Assmann WSW Components	-	RFQ	Datasheet	-	Bag	Obsolete	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
110-87-308-41-105161 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	Datasheet	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-308-41-006101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	Datasheet	116	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
382441-3 CONN SOCKET SIP 7POS TIN TE Connectivity AMP Connectors	-	RFQ	Datasheet	Diplomate DL	Tray	Obsolete	SIP	7 (1 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 105°C
2-382568-4 CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors	-	RFQ	Datasheet	Diplomate DL	Box	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 105°C
2-640463-4 CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	-	RFQ	Datasheet	Diplomate DL	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	15.0µin (0.38µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	15.0µin (0.38µm)	Phosphor Bronze	Thermoplastic, Glass Filled	-55°C ~ 125°C
ED044PLCZ-SM-N CONN SOCKET PLCC 44POS On Shore Technology Inc.	-	RFQ	Datasheet	ED	Tube	Active	PLCC	44 (2 x 22)	0.050" (1.27mm)	-	-	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	-	-	Phosphor Bronze	Polyphenylene Sulfide (PPS)	-55°C ~ 105°C
614-83-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	Datasheet	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 08-HZL/07-TT CONN IC DIP SOCKET 8POS GOLD Assmann WSW Components	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
123-87-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	Datasheet	123	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-83-304-41-007101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	Datasheet	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
D0806-01 CONN IC DIP SOCKET 6POS GOLD Harwin Inc.	-	RFQ	Datasheet	D0	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SIP050-1X08-157B 1X08-157B-SIP SOCKET 8 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	SIP050-1x	Bulk	Active	SIP	8 (1 x 8)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
231-20 CONN SOCKET PLCC 20POS GOLD CNC Tech	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	20 (4 x 5)	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
AW 127-29/Z-T SOCKET 29 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
917-87-103-41-005101 CONN TRANSIST TO-5 3POS GOLD Preci-Dip	-	RFQ	Datasheet	917	Bulk	Active	Transistor, TO-5	3 (Round)	-	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	-	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C

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