Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 96 - Original source of goods

Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
940-99-044-17-400000 CONN SOCKET PLCC 44POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datasheet	940	Tube	Obsolete	PLCC	44 (4 x 11)	0.050" (1.27mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
614-87-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	Datasheet	614	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0102-T-2 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	Datasheet	HLS	Tube	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
A22-LC-TR-R CONN IC DIP SOCKET 22POS TIN Assmann WSW Components	-	RFQ	Datasheet	-	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
110-87-308-41-105101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	Datasheet	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
HLS-0101-G-31 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	Datasheet	HLS	Tube	Active	SIP	1 (1 x 1)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	-	Thermoplastic	-55°C ~ 140°C
114-87-310-41-117101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	Datasheet	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-87-310-41-134161 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	Datasheet	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
822516-7 CONN SOCKET PLCC 32POS TIN TE Connectivity AMP Connectors	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Thermoplastic	-
SA1500300000G SA15003000J0G Amphenol Anytek	-	RFQ	-	*	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
940-99-052-24-000000 CONN SOCKET PLCC 52POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datasheet	940	Tube	Obsolete	PLCC	52 (4 x 13)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
AW 127-27/Z-T SOCKET 27 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
01-0503-20 CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	Datasheet	0503	Bulk	Active	SIP	1 (1 x 1)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-
01-0503-30 CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	Datasheet	0503	Bulk	Active	SIP	1 (1 x 1)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	30.0µin (0.76µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-
A28-LCG CONN IC DIP SOCKET 28POS GOLD Assmann WSW Components	-	RFQ	-	-	-	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	Gold	-	-	-	-
115-87-210-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	-	115	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
940-99-020-24-000000 CONN SOCKET PLCC 20POS TIN-LEAD Mill-Max Manufacturing Corp.	-	RFQ	Datasheet	940	Tube	Obsolete	PLCC	20 (4 x 5)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
A-CCS68-Z-SM CONN SOCKET PLCC 68POS TIN Assmann WSW Components	-	RFQ	Datasheet	-	Bag	Obsolete	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
DIP316-001B DIP SOCKET 16 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	-	Bag	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
122-83-304-41-001101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	Datasheet	122	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C

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