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Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
28-3575-11

28-3575-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

 0
RFQ
28-3575-11

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-6575-11

28-6575-11

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

 0
RFQ
28-6575-11

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
126-93-950-41-002000

126-93-950-41-002000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
126-93-950-41-002000

Datasheet

 		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-950-41-002000

126-43-950-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
126-43-950-41-002000

Datasheet

 		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0610-G-2

HLS-0610-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

 0
RFQ
HLS-0610-G-2

Datasheet

 		HLS Bulk Active SIP 60 (6 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
124-93-648-41-002000

124-93-648-41-002000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
124-93-648-41-002000

Datasheet

 		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-43-648-41-002000

124-43-648-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
124-43-648-41-002000

Datasheet

 		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
34-3503-21

34-3503-21

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

 0
RFQ
34-3503-21

Datasheet

 		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
34-3503-31

34-3503-31

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

 0
RFQ
34-3503-31

Datasheet

 		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
110-93-320-61-105000

110-93-320-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ

-

 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-420-61-105000

110-93-420-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ

-

 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0918-G-T

APH-0918-G-T

APH-0918-G-T

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1418-G-T

APH-1418-G-T

APH-1418-G-T

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0518-G-T

APH-0518-G-T

APH-0518-G-T

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1018-G-T

APH-1018-G-T

APH-1018-G-T

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1518-G-T

APH-1518-G-T

APH-1518-G-T

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1718-G-T

APH-1718-G-T

APH-1718-G-T

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0418-G-T

APH-0418-G-T

APH-0418-G-T

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
614-93-964-31-012000

614-93-964-31-012000

SOCKET CARRIER LOWPRO .900 64POS

Mill-Max Manufacturing Corp.

 0
RFQ
614-93-964-31-012000

Datasheet

 		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-964-31-012000

614-43-964-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 0
RFQ
614-43-964-31-012000

Datasheet

 		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Total 19086 Record«Prev1... 794795796797798799800801...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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