IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-43-314-61-003000

116-43-314-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-314-61-003000

116-93-314-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
121-13-650-41-001000

121-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
121-13-650-41-001000

Datasheet

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-632-61-006000

116-43-632-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-432-61-006000

116-93-432-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-632-61-006000

116-93-632-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
712-93-164-41-001000

712-93-164-41-001000

SOCKET CARRIER SIP 64POS

Mill-Max Manufacturing Corp.

0
RFQ
712-93-164-41-001000

Datasheet

712 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-640-61-105000

110-43-640-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-640-61-105000

110-93-640-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICO-640-BGG

ICO-640-BGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
RFQ
ICO-640-BGG

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-648-JGG

ICA-648-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0
RFQ
ICA-648-JGG

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
110-93-652-61-001000

110-93-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6508-212

28-6508-212

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-6508-212

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
28-6508-312

28-6508-312

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-6508-312

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
714-93-164-41-001000

714-93-164-41-001000

SOCKET CARRIER SIP 64POS

Mill-Max Manufacturing Corp.

0
RFQ
714-93-164-41-001000

Datasheet

714 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1422-G-H

APH-1422-G-H

APH-1422-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0522-G-H

APH-0522-G-H

APH-0522-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0622-G-H

APH-0622-G-H

APH-0622-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1622-G-H

APH-1622-G-H

APH-1622-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1222-G-H

APH-1222-G-H

APH-1222-G-H

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
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