Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 75 - Original source of goods

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
104670-0041 Socket-NAND 152 14.0 x 18.0 -1.0 Ironwood Electronics	25	-	RFQ	Datasheet	Grypper	Bag	Active	PGA	152	-	-	-	-	Surface Mount	-	Solder	-	-	-	-	-	-
108656-0036 Socket-NAND 152 14.0 x 18.0 -1.0 Ironwood Electronics	25	-	RFQ	Datasheet	Grypper	Bag	Active	PGA	152	-	-	-	-	Surface Mount	-	Solder	-	-	-	-	-	-
212018NE CONN IC DIP SOCKET 18POS Marutsuelec Co., Ltd.	840	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212020NE CONN IC DIP SOCKET 20POS Marutsuelec Co., Ltd.	778	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212028WE CONN IC DIP SOCKET 28POS Marutsuelec	848	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212024NE CONN IC DIP SOCKET 24POS Marutsuelec Co., Ltd.	402	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212028NE CONN IC DIP SOCKET 28POS Marutsuelec	381	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212040WE CONN IC DIP SOCKET 40POS Marutsuelec	209	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212118NE CONN IC DIP SOCKET 18POS Marutsuelec	126	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212120NE CONN IC DIP SOCKET 20POS Marutsuelec	690	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212124WE CONN IC DIP SOCKET 24POS Marutsuelec	486	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212128WE CONN IC DIP SOCKET 28POS Marutsuelec	358	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
CAP-002-04-00 0402 Capcitor Test Socket MiS Technologies	20	-	RFQ	Datasheet	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
108493-0009 DDR Socket, 78 BGA 7.5 mm x 10.6 Ironwood Electronics	25	-	RFQ	Datasheet	Grypper	Bag	Active	BGA	78 (6 x 13)	0.031" (0.80mm)	-	-	-	-	-	Solder	-	-	-	-	-	-
104670-0040 Socket-NAND 12.0 x 18.0 -1.0 SAC Ironwood Electronics	25	-	RFQ	Datasheet	Grypper	Bag	Active	PGA	132	-	-	-	-	Surface Mount	-	Solder	-	-	-	-	-	-
104670-0043 Socket-NAND 12.0 x 18.0 -1.0 pi Ironwood Electronics	25	-	RFQ	Datasheet	Grypper	Bag	Active	PGA	132	-	-	-	-	Surface Mount	-	Solder	-	-	-	-	-	-
108387-0026 Socket-eMMC/UFS,153 BGA 11.5 mm Ironwood Electronics	25	-	RFQ	Datasheet	-	Bag	Active	BGA	153 (12 x 13)	0.020" (0.50mm)	-	-	-	Through Hole	-	Solder	0.020" (0.50mm)	-	-	-	-	-
107250-0059 Socket-eMMC/UFS, 153 BGA 10.0 mm Ironwood Electronics	25	-	RFQ	Datasheet	-	Bag	Active	BGA	153 (12 x 13)	0.020" (0.50mm)	-	-	-	Through Hole	-	Solder	0.020" (0.50mm)	-	-	-	-	-
A 08-LC-TT CONN IC DIP SOCKET 8POS TIN Assmann WSW Components	0	-	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
110-41-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	0	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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