IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
299-43-324-10-001000

299-43-324-10-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

85
RFQ
299-43-324-10-001000

Datasheet

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-324-10-001000

299-93-324-10-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

25
RFQ
299-93-324-10-001000

Datasheet

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-049-07-000001

510-93-049-07-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

6
RFQ
510-93-049-07-000001

Datasheet

510 Tube Active DIP, 0.1" (2.54mm) Row Spacing 49 (7 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-640-41-801000

123-93-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

10
RFQ
123-93-640-41-801000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-964-41-001000

123-43-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

86
RFQ
123-43-964-41-001000

Datasheet

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
44-3572-11

44-3572-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

50
RFQ
44-3572-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-3573-11

44-3573-11

CONN IC DIP SOCKET ZIF 44POS GLD

Aries Electronics

47
RFQ
44-3573-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
210-83-308-41-101000

210-83-308-41-101000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

27
RFQ

-

210 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-83-308-41-530000

110-83-308-41-530000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

21
RFQ
110-83-308-41-530000

Datasheet

110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-83-316-41-530000

110-83-316-41-530000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

49
RFQ

-

110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-83-318-41-530000

110-83-318-41-530000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

21
RFQ
110-83-318-41-530000

Datasheet

110 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-83-628-41-530000

110-83-628-41-530000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

50
RFQ

-

110 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 300.0µin (7.62µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
CAP-002-01-00

CAP-002-01-00

0603 Capacitor Test Socket

MiS Technologies

17
RFQ
CAP-002-01-00

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
S582-11-898-15-001414

S582-11-898-15-001414

898 POS BGA SOCKET .050

Mill-Max Manufacturing Corp.

3
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
S530-10-898-15-001406

S530-10-898-15-001406

898 POS BGA HEADER .050

Mill-Max Manufacturing Corp.

5
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
108493-0014

108493-0014

DDR Socket, 96 BGA 7.5 mm x 13.1

Ironwood Electronics

25
RFQ
108493-0014

Datasheet

Grypper Bag Active BGA 96 (9 x 16) 0.031" (0.80mm) - - - - - Solder - - - - - -
108493-0015

108493-0015

DDR Socket, 96 BGA 7.5 mm x 13.1

Ironwood Electronics

25
RFQ
108493-0015

Datasheet

Grypper Bag Active BGA 96 (9 x 16) 0.031" (0.80mm) - - - - - Solder - - - - - -
107022-0048

107022-0048

DDR Socket, 78 BGA 7.5 mm x 10.6

Ironwood Electronics

23
RFQ
107022-0048

Datasheet

Grypper Bag Active BGA 78 (6 x 13) 0.031" (0.80mm) - - - - - Solder - - - - - -
108387-0059

108387-0059

Socket-eMMC/UFS, 153 BGA 10.0 mm

Ironwood Electronics

23
RFQ
108387-0059

Datasheet

- Bag Active BGA 153 (12 x 13) 0.020" (0.50mm) - - - Through Hole - Solder 0.020" (0.50mm) - - - - -
107250-0026

107250-0026

Socket-eMMC/UFS, 153 BGA 11.5 mm

Ironwood Electronics

21
RFQ
107250-0026

Datasheet

- Bag Active BGA 153 (12 x 13) 0.020" (0.50mm) - - - Through Hole - Solder 0.020" (0.50mm) - - - - -
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