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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
40-526-10CONN IC DIP SOCKET ZIF 40POS TIN |
74 |
|
Datasheet |
Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
28-6554-10CONN IC DIP SOCKET ZIF 28POS TIN |
85 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
25-0503-30CONN SOCKET SIP 25POS GOLD |
76 |
|
Datasheet |
0503 | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
|
110-91-632-41-001000CONN IC DIP SOCKET 32POS GOLD |
68 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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|
MPP-1100-05-DS-4GR(S1402)CONN TRANSIST TO-220/TO-247 5POS |
82 |
|
Datasheet |
- | Tray | Active | Transistor, TO-220 and TO-247 | 5 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Nickel Boron | Through Hole, Right Angle | - | Solder | - | Gold | 30.0µin (0.76µm) | Nickel Boron | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
|
24-6554-11CONN IC DIP SOCKET ZIF 24POS GLD |
95 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
48-6554-10CONN IC DIP SOCKET ZIF 48POS TIN |
79 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
40-6554-11CONN IC DIP SOCKET ZIF 40POS GLD |
31 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
228-1277-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
21 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
0804MCCONN TRANSIST TO-3 8POS GOLD |
30 |
|
Datasheet |
- | Tray | Active | Transistor, TO-3 | 8 (Oval) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyester, Glass Filled | -55°C ~ 150°C |
|
218-3341-00-0602JCONN IC DIP SOCKET ZIF 18POS GLD |
61 |
|
Datasheet |
Textool™ | Tray | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
216-7383-55-1902CONN SOCKET SOIC 16POS GOLD |
58 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
232-1287-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD |
34 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
210-2599-00-0602CONN SOCKET SIP ZIF 10POS GOLD |
33 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
224-5809-00-0602CONN SOCKET SIP ZIF 24POS GOLD |
18 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 24 (1 x 24) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
232-2601-00-0602CONN SOCKET SIP ZIF 32POS GOLD |
11 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 32 (1 x 32) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
|
108-PRS12005-12CONN SOCKET PGA ZIF GOLD |
7 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
|
240-5205-00CONN SOCKET QFN 40POS GOLD |
6 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
|
248-5205-00CONN SOCKET QFN 48POS GOLD |
13 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 48 (4 x 12) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
|
|
224-5205-01CONN SOCKET QFN 24POS GOLD |
22 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 24 (4x4) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
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