Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 51 - Original source of goods

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
APA-640-G-P ADAPTER PLUG Samtec Inc.	0	-	RFQ	Datasheet	APA	Bulk	Active	-	40 (2 x 20)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
2174988-1 CONN SOCKET LGA 2011POS GOLD TE Connectivity AMP Connectors	0	-	RFQ	Datasheet	-	Bulk	Obsolete	LGA	2011 (47 x 58)	0.040" (1.02mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.035" (0.90mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic	-
6-1437522-9 STAMPED PIN TE Connectivity AMP Connectors	0	-	RFQ	Datasheet	-	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
523-93-121-13-061001 PGA SOCK 121PIN 13X13 WIRE WRAP Mill-Max Manufacturing Corp.	295	-	RFQ	Datasheet	523	Bulk	Active	PGA	121 (13 x 13)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	-	Through Hole	-	Wire Wrap	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	-	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-
21218NE CONN IC DIP SOCKET 8POS Marutsuelec	2,268	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212014NE CONN IC DIP SOCKET 14POS Marutsuelec Co., Ltd.	1,214	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212016NE CONN IC DIP SOCKET 16POS Marutsuelec Co., Ltd.	1,364	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212024WE CONN IC DIP SOCKET 24POS Marutsuelec Co., Ltd.	1,892	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-30°C ~ 85°C
212114NE CONN IC DIP SOCKET 14POS Marutsuelec	1,559	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212116NE CONN IC DIP SOCKET 16POS Marutsuelec	1,764	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212124NE CONN IC DIP SOCKET 24POS Marutsuelec	489	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212128NE CONN IC DIP SOCKET 28POS Marutsuelec	1,023	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212132WE CONN IC DIP SOCKET 32POS Marutsuelec	575	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
212140WE CONN IC DIP SOCKET 40POS Marutsuelec	216	-	RFQ	Datasheet	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	-	-	-	Through Hole	Open Frame	-	0.100" (2.54mm)	-	-	-	-	-40°C ~ 105°C
2-1571552-6 820-AG11D-ESL-LF=800 DIP GF/SN TE Connectivity AMP Connectors	2,010	-	RFQ	Datasheet	800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	180.0µin (4.57µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
820-AG11D-ESL-LF IC SOCKET, DIP20, 20 CONTACT(S), TE Connectivity AMP Connectors	2,010	-	RFQ	Datasheet	800	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	180.0µin (4.57µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
3-1571552-2 840-AG11D-ESL-LF=800 DIP GF/SN TE Connectivity AMP Connectors	5,833	-	RFQ	Datasheet	800	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
840-AG11D-ESL-LF IC SOCKET, DIP40, 40 CONTACT(S), TE Connectivity AMP Connectors	5,833	-	RFQ	Datasheet	800	Bulk	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	40	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
110-87-210-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	416	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SA203000 CONN IC DIP SOCKET 20POS GOLD On Shore Technology Inc.	645	-	RFQ	Datasheet	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C

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