Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 106 - Original source of goods

Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
WMS-280Z CONN IC DIP SOCKET 28POS GOLD On Shore Technology Inc.	-	RFQ	Datasheet	WMS	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-40°C ~ 105°C
AR06-HZW/T-R CONN IC DIP SOCKET 6POS TIN Assmann WSW Components	-	RFQ	Datasheet	-	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
AR 20 HGL-TT SOCKET Assmann WSW Components	-	RFQ	-	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
HLS-0103-TT-12 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	Datasheet	HLS	Tube	Active	SIP	3 (1 x 3)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	-	Thermoplastic	-55°C ~ 140°C
110-83-210-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	Datasheet	110	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
110-87-310-41-105101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	Datasheet	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
DIP328-014B DIP328-014B-DIP SOCKET 28 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	-	Bag	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
AR28-HZL/7/07-TT CONN IC DIP SOCKET 28POS GOLD Assmann WSW Components	-	RFQ	Datasheet	-	Bag	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester	-40°C ~ 105°C
01-0503-31 CONN SOCKET SIP 1POS GOLD Aries Electronics	-	RFQ	Datasheet	0503	Bulk	Active	SIP	1 (1 x 1)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Gold	30.0µin (0.76µm)	Brass	Polyamide (PA), Nylon, Glass Filled	-
110-87-320-41-001151 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	-	RFQ	-	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, No Center Bar	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	Datasheet	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
A-CCS32-Z-SM-R CONN SOCKET PLCC 32POS TIN Assmann WSW Components	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
A-CCS020-Z-SM/P SOCKET Assmann WSW Components	-	RFQ	-	-	Bulk	Active	PLCC	20	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.050" (1.27mm)	Tin	160.0µin (4.06µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-40°C ~ 105°C
AW 127-38/Z-T SOCKET 38 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
410-87-214-10-001101 CONN ZIG-ZAG 14POS GOLD Preci-Dip	-	RFQ	Datasheet	410	Bulk	Active	Zig-Zag	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
410-87-214-10-002101 CONN ZIG-ZAG 14POS GOLD Preci-Dip	-	RFQ	Datasheet	410	Bulk	Active	Zig-Zag	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
124-83-304-41-002101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	-	RFQ	-	124	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	4 (2 x 2)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
116-87-610-41-006101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	Datasheet	116	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
1051670001 SMIA65 TOP MNT CAMERA SOCKET Molex	-	RFQ	Datasheet	105167	Tape & Reel (TR)	Obsolete	Camera Socket	12 (2 x 6)	0.037" (0.95mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	Gold	Flash	Copper Alloy	Thermoplastic	-55°C ~ 85°C
122-83-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	Datasheet	122	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C

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