Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 105 - Original source of goods

Mfr. Part #	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
06-1518-10H CONN IC DIP SOCKET 6POS GOLD Aries Electronics	-	RFQ	Datasheet	518	Bulk	Active	DIP, 0.2" (5.08mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
02-0517-90C CONN SOCKET SIP 2POS GOLD Aries Electronics	-	RFQ	Datasheet	0517	Bulk	Active	SIP	2 (1 x 2)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
HLS-0102-T-10 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	Datasheet	HLS	Tube	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
DIP624-011B DIP624-011B-DIP SOCKET 24 CTS Amphenol ICC (FCI)	-	RFQ	Datasheet	-	Bag	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-
130-028-000 CONN IC DIP SOCKET 28POS GOLD 3M	-	RFQ	-	100	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	8.00µin (0.203µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polyphenylene Sulfide (PPS), Glass Filled	-65°C ~ 125°C
110-87-310-41-105161 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	Datasheet	110	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AJ 42-LC SOCKET Assmann WSW Components	-	RFQ	-	-	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.070" (1.78mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.070" (1.78mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)	-55°C ~ 85°C
116-87-310-41-006101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	Datasheet	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
114-83-306-41-134191 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	-	RFQ	Datasheet	114	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
WMS-2810Z CONN IC DIP SOCKET 28POS GOLD On Shore Technology Inc.	-	RFQ	Datasheet	WMS	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame, Wash Away	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	-	-40°C ~ 105°C
AR 10-HZL/07-TT IC SOCKET 10 PIN MACH CONT Assmann WSW Components	-	RFQ	Datasheet	-	Tube	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
A-CCS32-G CONN SOCKET PLCC 32POS GOLD Assmann WSW Components	-	RFQ	Datasheet	-	Bag	Obsolete	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Gold	-	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
612-87-610-41-001101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	-	RFQ	Datasheet	612	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	10 (2 x 5)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
05-0518-11 CONN SOCKET SIP 5POS GOLD Aries Electronics	-	RFQ	Datasheet	518	Bulk	Active	SIP	5 (1 x 5)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
AW 127-37/Z-T SOCKET 37 CONTACTS SINGLE ROW Assmann WSW Components	-	RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
A-CCS52-Z-SM-R CONN SOCKET PLCC 52POS TIN Assmann WSW Components	-	RFQ	Datasheet	-	Tube	Obsolete	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	150.0µin (3.81µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
116-87-308-41-012101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	-	RFQ	Datasheet	116	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
AR 22-HGL/7-TT SOCKET Assmann WSW Components	-	RFQ	-	AR	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	Flash	Brass	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
HLS-0102-T-11 .100" SCREW MACHINE SOCKET ARRAY Samtec Inc.	-	RFQ	Datasheet	HLS	Tube	Active	SIP	2 (1 x 2)	0.100" (2.54mm)	Tin	-	-	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	-	Thermoplastic	-55°C ~ 140°C
510-83-012-05-001101 CONN SOCKET PGA 12POS GOLD Preci-Dip	-	RFQ	Datasheet	510	Bulk	Active	PGA	12 (5 x 5)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C

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