Pads, Sheets

制造商 Series Packaging Product Status Usage Type Shape Outline Thickness Material Adhesive Backing, Carrier Color Thermal Resistivity Thermal Conductivity



































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Microchip Technology
全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Usage Type Shape Outline Thickness Material Adhesive Backing, Carrier Color Thermal Resistivity Thermal Conductivity
ST-2X3

ST-2X3

THERMAL PAD, SA50 SERIES

Microchip Technology

0
RFQ
ST-2X3

Datasheet

- Bulk Active - - - - - - - - - - -
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