Heat Sinks

制造商 Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material 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全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Package Cooled Attachment Method Shape Length Width Diameter Fin Height Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Material Finish
ATS-X51400K-C1-R0

ATS-X51400K-C1-R0

MAXIFLOW 39.25X39.25X14.5MM T766

Advanced Thermal Solutions Inc.

115
RFQ
ATS-X51400K-C1-R0

Datasheet

maxiFLOW, superGRIP™ Bulk Active Top Mount BGA Clip, Thermal Material Square, Angled Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.571" (14.50mm) - 2.50°C/W @ 200 LFM - Aluminum Blue Anodized
ATS-X51425K-C1-R0

ATS-X51425K-C1-R0

MAXIFLOW 41.75X41.75X14.5MM T766

Advanced Thermal Solutions Inc.

125
RFQ

-

- Bulk Active - - - - - - - - - - - - -
ATS-X53450R-C1-R0

ATS-X53450R-C1-R0

STR FIN 44.25X44.25X19.5MM T766

Advanced Thermal Solutions Inc.

125
RFQ

-

- Bulk Active - - - - - - - - - - - - -
4-1542005-0

4-1542005-0

HEAT SINK BGA 25MM 7FIN RADIAL

TE Connectivity AMP Connectors

257
RFQ
4-1542005-0

Datasheet

- Box Active - BGA Clip Cylindrical - - 1.375" (34.92mm) OD 0.894" (22.71mm) - 3.80°C/W @ 200 LFM 10.50°C/W Aluminum Black Anodized
DHS-B10670-04A

DHS-B10670-04A

HEATSINK ASSY LGA2011 NARROW

Delta Electronics

288
RFQ
DHS-B10670-04A

Datasheet

- Box Not For New Designs Board Level LGA Bolt On Rectangular, Fins 4.173" (106.00mm) 2.756" (70.00mm) - 1.004" (25.50mm) - - 0.26°C/W Aluminum -
127791

127791

5.64" WIDE X 36" MULTI CHANNEL 7

Wakefield-Vette

154
RFQ
127791

Datasheet

- Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 36.000" (914.40mm) 5.640" (143.26mm) - 1.000" (25.40mm) - - 0.57°C/W Aluminum -
127761

127761

5.86" X 36" FLATBACK HEATSINK 14

Wakefield-Vette

30
RFQ
127761

Datasheet

- Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 36.000" (914.40mm) 5.860" (148.84mm) - 2.000" (50.80mm) - - 0.28°C/W Aluminum -
127757

127757

4.461" WIDE X 36" FLATBACK HEATS

Wakefield-Vette

46
RFQ
127757

Datasheet

- Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 36.000" (914.40mm) 4.461" (113.31mm) - 1.310" (33.27mm) - - 0.45°C/W Aluminum -
127689

127689

3.375" X 12" H STYLE HEATSINK 17

Wakefield-Vette

52
RFQ
127689

Datasheet

- Box Active Board Level, Extrusion - Bolt On Rectangular, Fins 12.000" (304.80mm) 3.750" (95.25mm) - 9.000" (228.60mm) - - 0.15°C/W Aluminum -
ATS-UC-NF-201

ATS-UC-NF-201

CPU HEAT SINK NO FAN COPPER

Advanced Thermal Solutions Inc.

105
RFQ
ATS-UC-NF-201

Datasheet

- Box Active Top Mount, Skived Intel LGA2011 & LGA2066 CPU Cooler Push Pin Square, Fins 3.543" (90.00mm) 3.543" (90.00mm) - 1.102" (28.00mm) - - - Copper Nickel
ATS-UC-QFLOW-200

ATS-UC-QFLOW-200

QUADFLOW HEATSINK 1U CU FINS

Advanced Thermal Solutions Inc.

99
RFQ
ATS-UC-QFLOW-200

Datasheet

quadFLOW™ Box Active Top Mount, Zipper Fin Intel LGA2011 & LGA2066 CPU Cooler Push Pin Square, Fins 3.637" (92.38mm) 3.626" (92.11mm) - 1.142" (29.00mm) - - - Copper Nickel
127779

127779

11.42" WIDE X 36" FLATBACK HEAT

Wakefield-Vette

26
RFQ
127779

Datasheet

- Box Active Top Mount, Extrusion - Adhesive Rectangular, Fins 36.000" (914.40mm) 11.420" (290.07mm) - 2.559" (65.00mm) - - 0.19°C/W Aluminum -
262-75ABE375

262-75ABE375

HEATSINK VERT/HORIZ TO-220

Wakefield-Vette

4,580
RFQ
262-75ABE375

Datasheet

262 Bulk Active Board Level, Vertical TO-220 Press Fit and PC Pin Rectangular, Fins 0.750" (19.05mm) 0.570" (14.47mm) - 0.500" (12.70mm) 3.0W @ 80°C 10.00°C/W @ 200 LFM 26.70°C/W Aluminum Black Anodized
ATS-PCB1032

ATS-PCB1032

HEATSINK CLIP-ON TO-220 BLK

Advanced Thermal Solutions Inc.

2,494
RFQ
ATS-PCB1032

Datasheet

- Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 0.850" (21.59mm) 1.000" (25.40mm) - 0.500" (12.70mm) - 9.00°C/W @ 200 LFM 20.00°C/W Aluminum Black Anodized
HSB31-212105

HSB31-212105

HEAT SINK, BGA, 21 X 21 X 5 MM

Same Sky (Formerly CUI Devices)

1,836
RFQ
HSB31-212105

Datasheet

HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.197" (5.00mm) 3.0W @ 75°C 9.90°C/W @ 200 LFM 25.33°C/W Aluminum Alloy Black Anodized
650-B

650-B

HEATSINK FOR DIPS

Wakefield-Vette

8,889
RFQ
650-B

Datasheet

650 Bulk Active Top Mount 14-DIP and 16-DIP Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.250" (6.35mm) 0.740" (18.80mm) - 0.240" (6.10mm) 0.5W @ 40°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
ATS-PCB1033

ATS-PCB1033

HEATSINK CLIP-ON TO-220 W/TAB

Advanced Thermal Solutions Inc.

2,269
RFQ
ATS-PCB1033

Datasheet

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 0.850" (21.59mm) 1.000" (25.40mm) - 0.500" (12.70mm) - 9.00°C/W @ 200 LFM 20.00°C/W Aluminum Black Anodized
V7477Y

V7477Y

HEATSINK ALUM ANOD

Assmann WSW Components

200
RFQ
V7477Y

Datasheet

- Tray Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Bolt On and PC Pin Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.500" (12.70mm) - - 9.00°C/W Aluminum Black Anodized
HSB34-282811

HSB34-282811

HEAT SINK, BGA, 28 X 28 X 11.2 M

Same Sky (Formerly CUI Devices)

1,105
RFQ
HSB34-282811

Datasheet

HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.102" (28.00mm) 1.102" (28.00mm) - 0.441" (11.20mm) 5.0W @ 75°C 5.10°C/W @ 200 LFM 15.05°C/W Aluminum Alloy Black Anodized
630-35AB

630-35AB

HEATSINK FOR 35MM BGA

Wakefield-Vette

2,831
RFQ
630-35AB

Datasheet

630 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378" (35.00mm) 1.378" (35.00mm) - 0.350" (8.89mm) - 5.00°C/W @ 500 LFM - Aluminum Black Anodized
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