Solder

制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





















































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
CQ-SS-SNBIAG-0.76MM-25000

CQ-SS-SNBIAG-0.76MM-25000

SOLDER SPHERES SN42/BI57.6/AG0.4

Chip Quik Inc.

0
RFQ
CQ-SS-SNBIAG-0.76MM-25000

Datasheet

- Bulk Active Solder Sphere Bi57.6Sn42Ag0.4 (57.6/42/0.4) 0.030" (0.76mm) 280°F (138°C) - - - - Jar 24 Months Date of Manufacture -
SMD291AX250T6

SMD291AX250T6

SOLDER PASTE IN JAR 250G (T6) SN

Chip Quik Inc.

0
RFQ
SMD291AX250T6

Datasheet

CHIPQUIK® Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - - Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture -
JET551SNL30T5

JET551SNL30T5

JET PRINTING SOLDER PASTE SN96.5

Chip Quik Inc.

0
RFQ
JET551SNL30T5

Datasheet

CHIPQUIK® Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - - - Syringe, 3.53 oz (100g) 12 Months Date of Manufacture -
JET551LT30T5

JET551LT30T5

JET PRINTING SOLDER PASTE SN42/B

Chip Quik Inc.

0
RFQ
JET551LT30T5

Datasheet

CHIPQUIK® Bulk Active Solder Paste Sn42Bi57.6Ag0.4 (42/57.6/0.4) - 280°F (138°C) No-Clean - - - Syringe, 3.53 oz (100g) 12 Months Date of Manufacture -
TS991AX500T4

TS991AX500T4

SOLDER PASTE THERMALLY STABLE NC

Chip Quik Inc.

0
RFQ
TS991AX500T4

Datasheet

CHIPQUIK® Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Jar, 17.64 oz (500g) 12 Months Date of Manufacture -
SMD291SNL500T3

SMD291SNL500T3

SOLDER PASTE SAC305 500G

Chip Quik Inc.

0
RFQ
SMD291SNL500T3

Datasheet

- Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Jar, 17.64 oz (500g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD291SNL500T3C

SMD291SNL500T3C

SOLDER PASTE NO-CLEAN SAC305 T3

Chip Quik Inc.

0
RFQ
SMD291SNL500T3C

Datasheet

- Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD4300SNL500T3C

SMD4300SNL500T3C

SOLDER PASTE SAC305 T3 500G

Chip Quik Inc.

0
RFQ
SMD4300SNL500T3C

Datasheet

CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - 3 Lead Free Cartridge, 17.64 oz (500g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD2060

SMD2060

SOLDER SPHERES SAC305 .030 DIAM

Chip Quik Inc.

0
RFQ
SMD2060

Datasheet

SMD2 Bulk Active Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.030" (0.76mm) 423 ~ 428°F (217 ~ 220°C) - - - Lead Free Jar 24 Months Date of Manufacture -
SMD2050

SMD2050

SOLDER SPHERES SAC305 .024 DIAM

Chip Quik Inc.

0
RFQ
SMD2050

Datasheet

SMD2 Bulk Active Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.024" (0.61mm) 423 ~ 428°F (217 ~ 220°C) - - - Lead Free Jar 24 Months Date of Manufacture -
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