Solder

制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





















































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
SMDSW.031 1LB

SMDSW.031 1LB

SOLDER WIRE 63/37 TIN/LEAD NO-CL

Chip Quik Inc.

20
RFQ
SMDSW.031 1LB

Datasheet

- Bulk Active Wire Solder Sn63Pb37 (63/37) 0.031" (0.79mm) 361°F (183°C) No-Clean, Water Soluble 20 AWG, 22 SWG - Leaded Spool, 1 lb (454 g) - - -
NCSW.031 1LB

NCSW.031 1LB

SOLDER WIRE 63/37 TIN/LEAD NO-CL

Chip Quik Inc.

11
RFQ
NCSW.031 1LB

Datasheet

- Bulk Active Wire Solder Sn63Pb37 (63/37) 0.031" (0.79mm) 361°F (183°C) No-Clean 20 AWG, 21 SWG - Leaded Spool, 1 lb (454 g) - - -
SMDLTLFP60T4

SMDLTLFP60T4

SN42/BI57.6/AG0.4 2-PART MIX 60G

Chip Quik Inc.

6
RFQ
SMDLTLFP60T4

Datasheet

- Bulk Active Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 2.12 oz (60g) 24 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C)
WS991LT35T4

WS991LT35T4

THERMALLY STABLE SOLDER PASTE WS

Chip Quik Inc.

6
RFQ
WS991LT35T4

Datasheet

CHIPQUIK® Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 280°F (138°C) Water Soluble - 4 - Syringe, 1.23 oz (34.869g) 12 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C)
NCSW.020 1LB

NCSW.020 1LB

SOLDER WIRE 63/37 TIN/LEAD NO-CL

Chip Quik Inc.

13
RFQ
NCSW.020 1LB

Datasheet

- Bulk Active Wire Solder Sn63Pb37 (63/37) 0.020" (0.51mm) 361°F (183°C) No-Clean 24 AWG, 25 SWG - Leaded Spool, 1 lb (454 g) - - -
SMD2SWLT.047 4OZ

SMD2SWLT.047 4OZ

SOLDER WIRE SN42/BI57.6/AG0.4 .0

Chip Quik Inc.

8
RFQ
SMD2SWLT.047 4OZ

Datasheet

SMD2 Bulk Active Wire Solder Bi57.6Sn42Ag0.4 (57.6/42/0.4) 0.047" (1.19mm) 280°F (138°C) - - - Lead Free Spool, 4 oz (113.40g) - - -
SMD4300AX250T3

SMD4300AX250T3

SOLDER PASTE SN63/PB37 250G

Chip Quik Inc.

9
RFQ
SMD4300AX250T3

Datasheet

CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean, Water Soluble - 3 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD2SWLF.012 100G

SMD2SWLF.012 100G

LF SOLDER WIRE 99.3/0.7 TIN/COPP

Chip Quik Inc.

17
RFQ
SMD2SWLF.012 100G

Datasheet

SMD2 Bulk Active Wire Solder Sn99.3Cu0.7 (99.3/0.7) 0.012" (0.31mm) 441°F (227°C) No-Clean, Water Soluble 28 AWG, 30 SWG - Lead Free Spool, 3.53 oz (100g) - - -
REM4.5-ULTRA-NL

REM4.5-ULTRA-NL

ULTRA LOW TEMP FLUX CORED CHIP R

Chip Quik Inc.

13
RFQ
REM4.5-ULTRA-NL

Datasheet

CHIPQUIK® Bulk Active - - - 144°F (62°C) No-Clean, Water Soluble - - Lead Free - - - -
EXB-SN62PB36AG2

EXB-SN62PB36AG2

SOLDER BAR SN62/PB36/AG2 1LB (45

Chip Quik Inc.

16
RFQ
EXB-SN62PB36AG2

Datasheet

Super Low Dross™ Bulk Active Bar Solder Sn62Pb36Ag2 (62/36/2) - 354°F (179°C) - - - Leaded Bar, 1 lb (454g) - - -
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