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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
558-10-456M26-001101

558-10-456M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

 0
RFQ
558-10-456M26-001101

Datasheet

 		558 Bulk Active PGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-420M26-001106

518-77-420M26-001106

CONN SOCKET PGA 420POS GOLD

Preci-Dip

 0
RFQ
518-77-420M26-001106

Datasheet

 		518 Bulk Active PGA 420 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
249-930X-XX-2401

249-930X-XX-2401

CONN SOCKET BGA 49POS GOLD

3M

 0
RFQ

-

 Textool™ - Obsolete BGA 49 (Verification Required) 0.039" (1.00mm) Gold - - Through Hole Closed Frame - - - - - - -
558-10-432M31-001104

558-10-432M31-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

 0
RFQ
558-10-432M31-001104

Datasheet

 		558 Bulk Active BGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
40-3551-16

40-3551-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 0
RFQ
40-3551-16

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-3552-16

40-3552-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 0
RFQ
40-3552-16

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-6551-16

40-6551-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 0
RFQ
40-6551-16

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-6552-16

40-6552-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 0
RFQ
40-6552-16

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
40-6553-16

40-6553-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 0
RFQ
40-6553-16

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
40-3554-16

40-3554-16

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

 0
RFQ
40-3554-16

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
546-83-559-22-131147

546-83-559-22-131147

CONN SOCKET PGA 559POS GOLD

Preci-Dip

 0
RFQ
546-83-559-22-131147

Datasheet

 		546 Bulk Active PGA 559 (22 x 22) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
42-3570-16

42-3570-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

 0
RFQ
42-3570-16

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
42-3571-16

42-3571-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

 0
RFQ
42-3571-16

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
42-3573-16

42-3573-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

 0
RFQ
42-3573-16

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
42-3574-16

42-3574-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 0
RFQ
42-3574-16

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-3575-16

42-3575-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 0
RFQ
42-3575-16

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6570-16

42-6570-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

 0
RFQ
42-6570-16

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
42-6572-16

42-6572-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 0
RFQ
42-6572-16

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6573-16

42-6573-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 0
RFQ
42-6573-16

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6575-16

42-6575-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

 0
RFQ
42-6575-16

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
Total 19086 Record«Prev1... 892893894895896897898899...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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