IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
133-PGM14014-50

133-PGM14014-50

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
133-PGM14014-50

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
APH-0840-G-T

APH-0840-G-T

APH-0840-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1340-G-T

APH-1340-G-T

APH-1340-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0940-G-T

APH-0940-G-T

APH-0940-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0440-G-T

APH-0440-G-T

APH-0440-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1840-G-T

APH-1840-G-T

APH-1840-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0540-G-T

APH-0540-G-T

APH-0540-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0640-G-T

APH-0640-G-T

APH-0640-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1740-G-T

APH-1740-G-T

APH-1740-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0740-G-T

APH-0740-G-T

APH-0740-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1140-G-T

APH-1140-G-T

APH-1140-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
510-13-096-11-041001

510-13-096-11-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
510-13-096-11-041001

Datasheet

510 Tube Active PGA 96 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6556-40

28-6556-40

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-6556-40

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
116-43-964-61-008000

116-43-964-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-964-61-008000

116-93-964-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0520-G-2

HLS-0520-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0520-G-2

Datasheet

HLS Bulk Active SIP 100 (5 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
550-10-352M26-001166

550-10-352M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0
RFQ
550-10-352M26-001166

Datasheet

550 Bulk Active BGA 352 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
HLS-0420-G-10

HLS-0420-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
RFQ
HLS-0420-G-10

Datasheet

HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
APH-0932-G-T

APH-0932-G-T

APH-0932-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1532-G-T

APH-1532-G-T

APH-1532-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
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