IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1422-G-T

APH-1422-G-T

APH-1422-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0922-G-T

APH-0922-G-T

APH-0922-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1922-G-T

APH-1922-G-T

APH-1922-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1122-G-T

APH-1122-G-T

APH-1122-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0322-G-T

APH-0322-G-T

APH-0322-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1322-G-T

APH-1322-G-T

APH-1322-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0722-G-T

APH-0722-G-T

APH-0722-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0222-G-T

APH-0222-G-T

APH-0222-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0822-G-T

APH-0822-G-T

APH-0822-G-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
1051420433

1051420433

CONN SOCKET LGA 2011POS GOLD

Molex

0
RFQ
1051420433

Datasheet

105142 Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - - Thermoplastic -
28-6508-211

28-6508-211

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-6508-211

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
28-6508-311

28-6508-311

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0
RFQ
28-6508-311

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
110-43-432-61-105000

110-43-432-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-308-61-105000

110-43-308-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-316-61-605000

110-43-316-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-316-61-605000

110-93-316-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-085-11-041001

510-93-085-11-041001

CONN SOCKET PGA 85POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
510-93-085-11-041001

Datasheet

510 Tube Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1816-G-R

APH-1816-G-R

APH-1816-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0616-G-R

APH-0616-G-R

APH-0616-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0216-G-R

APH-0216-G-R

APH-0216-G-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
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