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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-41-652-41-001000

116-41-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
116-41-652-41-001000

Datasheet

 		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-652-41-001000

116-91-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
116-91-652-41-001000

Datasheet

 		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-0511-11

32-0511-11

CONN SOCKET SIP 32POS GOLD

Aries Electronics

 0
RFQ
32-0511-11

Datasheet

 		511 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
110-43-210-61-001000

110-43-210-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ

-

 110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-43-310-61-001000

111-43-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ

-

 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-310-61-001000

111-93-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ

-

 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1936-T-R

APH-1936-T-R

APH-1936-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0836-T-R

APH-0836-T-R

APH-0836-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0636-T-R

APH-0636-T-R

APH-0636-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1636-T-R

APH-1636-T-R

APH-1636-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0336-T-R

APH-0336-T-R

APH-0336-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0436-T-R

APH-0436-T-R

APH-0436-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
126-41-650-41-002000

126-41-650-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
126-41-650-41-002000

Datasheet

 		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-650-41-002000

126-91-650-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
126-91-650-41-002000

Datasheet

 		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-952-31-002000

614-43-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 0
RFQ
614-43-952-31-002000

Datasheet

 		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-952-31-002000

614-93-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 0
RFQ
614-93-952-31-002000

Datasheet

 		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-93-101-13-061001

510-93-101-13-061001

PGA SOCK 101PIN 13X13 SOLDER TL

Mill-Max Manufacturing Corp.

 0
RFQ

-

 510 Tube Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-632-G-A

APA-632-G-A

ADAPTER PLUG

Samtec Inc.

 0
RFQ
APA-632-G-A

Datasheet

 		APA Bulk Active - 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-632-G-A

APO-632-G-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

 0
RFQ
APO-632-G-A

Datasheet

 		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
614-93-952-31-007000

614-93-952-31-007000

SOCKET CARRIER LOWPRO .900 52POS

Mill-Max Manufacturing Corp.

 0
RFQ
614-93-952-31-007000

Datasheet

 		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Total 19086 Record«Prev1... 758759760761762763764765...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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