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Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
612-91-648-41-003000

612-91-648-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

 0
RFQ
612-91-648-41-003000

Datasheet

 		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-648-41-770000

104-13-648-41-770000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
104-13-648-41-770000

Datasheet

 		104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
122-11-636-41-001000

122-11-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
122-11-636-41-001000

Datasheet

 		122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-87-429-19-101111

517-87-429-19-101111

CONN SOCKET PGA 429POS GOLD

Preci-Dip

 0
RFQ
517-87-429-19-101111

Datasheet

 		517 Bulk Active PGA 429 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
124-41-642-41-002000

124-41-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
124-41-642-41-002000

Datasheet

 		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-642-41-002000

124-91-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
124-91-642-41-002000

Datasheet

 		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-320-61-605000

110-43-320-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ

-

 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
20-4508-21

20-4508-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

 0
RFQ
20-4508-21

Datasheet

 		508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
20-4508-31

20-4508-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

 0
RFQ
20-4508-31

Datasheet

 		508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
APO-324-G-R

APO-324-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

 0
RFQ
APO-324-G-R

Datasheet

 		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-624-G-R

APO-624-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

 0
RFQ
APO-624-G-R

Datasheet

 		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
614-93-650-31-018000

614-93-650-31-018000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
614-93-650-31-018000

Datasheet

 		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-650-31-018000

614-43-650-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 0
RFQ
614-43-650-31-018000

Datasheet

 		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-322-61-001000

110-43-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ

-

 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0936-T-H

APH-0936-T-H

APH-0936-T-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0536-T-H

APH-0536-T-H

APH-0536-T-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1936-T-H

APH-1936-T-H

APH-1936-T-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1736-T-H

APH-1736-T-H

APH-1736-T-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1636-T-H

APH-1636-T-H

APH-1636-T-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0836-T-H

APH-0836-T-H

APH-0836-T-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
Total 19086 Record«Prev1... 749750751752753754755756...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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