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Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0212-G-R

APH-0212-G-R

APH-0212-G-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0912-G-R

APH-0912-G-R

APH-0912-G-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1312-G-R

APH-1312-G-R

APH-1312-G-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1812-G-R

APH-1812-G-R

APH-1812-G-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
ICO-632-JGG

ICO-632-JGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

 0
RFQ
ICO-632-JGG

Datasheet

 		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-632-JGG

ICA-632-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

 0
RFQ
ICA-632-JGG

Datasheet

 		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
612-11-328-41-001000

612-11-328-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

 0
RFQ
612-11-328-41-001000

Datasheet

 		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-428-41-001000

612-11-428-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

 0
RFQ
612-11-428-41-001000

Datasheet

 		612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-628-41-001000

612-11-628-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

 0
RFQ
612-11-628-41-001000

Datasheet

 		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-87-183-14-091147

546-87-183-14-091147

CONN SOCKET PGA 183POS GOLD

Preci-Dip

 0
RFQ
546-87-183-14-091147

Datasheet

 		546 Bulk Active PGA 183 (14 x 14) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-149-15-063112

614-87-149-15-063112

CONN SOCKET PGA 149POS GOLD

Preci-Dip

 0
RFQ
614-87-149-15-063112

Datasheet

 		614 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-41-668-41-005000

117-41-668-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
117-41-668-41-005000

Datasheet

 		117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-91-668-41-005000

117-91-668-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
117-91-668-41-005000

Datasheet

 		117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-6503-21

24-6503-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 0
RFQ
24-6503-21

Datasheet

 		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-6503-31

24-6503-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 0
RFQ
24-6503-31

Datasheet

 		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-93-432-41-001000

116-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
116-93-432-41-001000

Datasheet

 		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-632-41-001000

116-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
116-93-632-41-001000

Datasheet

 		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-432-41-001000

116-43-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
116-43-432-41-001000

Datasheet

 		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-632-41-001000

116-43-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
116-43-632-41-001000

Datasheet

 		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-640-31-002000

614-43-640-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 0
RFQ
614-43-640-31-002000

Datasheet

 		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Total 19086 Record«Prev1... 708709710711712713714715...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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