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Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
122-13-624-41-001000

122-13-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
122-13-624-41-001000

Datasheet

 		122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0928-T-R

APH-0928-T-R

APH-0928-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0728-T-R

APH-0728-T-R

APH-0728-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1228-T-R

APH-1228-T-R

APH-1228-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0228-T-R

APH-0228-T-R

APH-0228-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1628-T-R

APH-1628-T-R

APH-1628-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
44-6556-30

44-6556-30

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

 0
RFQ
44-6556-30

Datasheet

 		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
44-6556-20

44-6556-20

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

 0
RFQ
44-6556-20

Datasheet

 		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
24-3551-11

24-3551-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 0
RFQ
24-3551-11

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-3552-11

24-3552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 0
RFQ
24-3552-11

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-3553-11

24-3553-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 0
RFQ
24-3553-11

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6551-11

24-6551-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 0
RFQ
24-6551-11

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-6552-11

24-6552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 0
RFQ
24-6552-11

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
24-3554-11

24-3554-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

 0
RFQ
24-3554-11

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
210790-4

210790-4

CONN SOCKET PGA 128POS GOLD

TE Connectivity AMP Connectors

 0
RFQ
210790-4

Datasheet

 		STA Bulk Obsolete PGA 128 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 118.1µin (3.00µm) Phosphor Bronze Thermoplastic, Polyester, Glass Filled -
24-3503-31

24-3503-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 0
RFQ
24-3503-31

Datasheet

 		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-6572-10

40-6572-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

 0
RFQ
40-6572-10

Datasheet

 		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
APA-648-T-C

APA-648-T-C

ADAPTER PLUG

Samtec Inc.

 0
RFQ
APA-648-T-C

Datasheet

 		APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
126-93-432-41-001000

126-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
126-93-432-41-001000

Datasheet

 		126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-632-41-001000

126-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
126-93-632-41-001000

Datasheet

 		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Total 19086 Record«Prev1... 691692693694695696697698...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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