IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-13-642-41-001000

110-13-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
110-13-642-41-001000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
132-PGM14015-10

132-PGM14015-10

CONN SOCKET PGA GOLD

Aries Electronics

0
RFQ
132-PGM14015-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-47-952-41-006000

116-47-952-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
116-47-952-41-006000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-232-31-018000

714-43-232-31-018000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-43-232-31-018000

Datasheet

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1340-T-T

APH-1340-T-T

APH-1340-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0840-T-T

APH-0840-T-T

APH-0840-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0440-T-T

APH-0440-T-T

APH-0440-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0940-T-T

APH-0940-T-T

APH-0940-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1440-T-T

APH-1440-T-T

APH-1440-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1940-T-T

APH-1940-T-T

APH-1940-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0540-T-T

APH-0540-T-T

APH-0540-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1040-T-T

APH-1040-T-T

APH-1040-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0740-T-T

APH-0740-T-T

APH-0740-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0240-T-T

APH-0240-T-T

APH-0240-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0640-T-T

APH-0640-T-T

APH-0640-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1640-T-T

APH-1640-T-T

APH-1640-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1140-T-T

APH-1140-T-T

APH-1140-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0340-T-T

APH-0340-T-T

APH-0340-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
24-526-11

24-526-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

0
RFQ
24-526-11

Datasheet

Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
612-41-328-41-004000

612-41-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0
RFQ
612-41-328-41-004000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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