IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
123-91-432-41-001000

123-91-432-41-001000

SOCKET IC OPEN 3 LVL .400 32POS

Mill-Max Manufacturing Corp.

0
RFQ

-

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-91-632-41-001000

123-91-632-41-001000

SOCKET IC OPEN 3 LVL .600 32POS

Mill-Max Manufacturing Corp.

0
RFQ

-

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-432-41-001000

123-41-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
123-41-432-41-001000

Datasheet

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-41-632-41-001000

123-41-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
123-41-632-41-001000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
18-822-90T

18-822-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0
RFQ
18-822-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
18-823-90T

18-823-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0
RFQ
18-823-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
123-11-318-41-001000

123-11-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
123-11-318-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-87-133-14-071112

614-87-133-14-071112

CONN SOCKET PGA 133POS GOLD

Preci-Dip

0
RFQ
614-87-133-14-071112

Datasheet

614 Bulk Active PGA 133 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
60-9513-10H

60-9513-10H

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0
RFQ
60-9513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
117-41-428-41-105000

117-41-428-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
117-41-428-41-105000

Datasheet

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-636-41-006000

116-93-636-41-006000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
116-93-636-41-006000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-636-41-006000

116-43-636-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
116-43-636-41-006000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-154-31-018000

714-43-154-31-018000

CONN SOCKET SIP 54POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
714-43-154-31-018000

Datasheet

714 Bulk Active SIP 54 (1 x 54) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0428-T-T

APH-0428-T-T

APH-0428-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0426-T-R

APH-0426-T-R

APH-0426-T-R

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1828-T-T

APH-1828-T-T

APH-1828-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1428-T-T

APH-1428-T-T

APH-1428-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0528-T-T

APH-0528-T-T

APH-0528-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1028-T-T

APH-1028-T-T

APH-1028-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0628-T-T

APH-0628-T-T

APH-0628-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
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