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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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116-91-648-41-006000CONN IC SKT DBL |
0 |
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Datasheet |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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510-83-309-21-001101CONN SOCKET PGA 309POS GOLD |
0 |
|
Datasheet |
510 | Bulk | Active | PGA | 309 (21 x 21) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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124-41-324-41-002000CONN IC SKT DBL |
0 |
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Datasheet |
124 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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124-41-424-41-002000CONN IC SKT DBL |
0 |
|
Datasheet |
124 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
124-41-624-41-002000CONN IC SKT DBL |
0 |
|
Datasheet |
124 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
124-91-324-41-002000CONN IC SKT DBL |
0 |
|
Datasheet |
124 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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124-91-424-41-002000CONN IC SKT DBL |
0 |
|
Datasheet |
124 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
124-91-624-41-002000CONN IC SKT DBL |
0 |
|
Datasheet |
124 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
612-13-316-41-001000CONN IC DIP SOCKET 16POS GOLD |
0 |
|
Datasheet |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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614-43-328-31-002000SKT CARRIER PGA |
0 |
|
Datasheet |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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614-43-428-31-002000SKT CARRIER PGA |
0 |
|
Datasheet |
614 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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614-43-628-31-002000SKT CARRIER PGA |
0 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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614-93-328-31-002000SKT CARRIER PGA |
0 |
|
Datasheet |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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614-93-428-31-002000SKT CARRIER PGA |
0 |
|
Datasheet |
614 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
614-93-628-31-002000SKT CARRIER PGA |
0 |
|
Datasheet |
614 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
104-11-432-41-770000CONN IC SKT DBL |
0 |
|
Datasheet |
104 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
104-11-632-41-770000CONN IC SKT DBL |
0 |
|
Datasheet |
104 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
550-80-144-15-081101PGA SOLDER TAIL |
0 |
|
Datasheet |
550 | Bulk | Active | PGA | 144 (15 x 15) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
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550-80-144-12-000101PGA SOLDER TAIL |
0 |
|
Datasheet |
550 | Bulk | Active | PGA | 144 (12 x 12) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
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614-93-328-31-007000SOCKET CARRIER LOWPRO .300 28POS |
0 |
|
Datasheet |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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