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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
24-1508-31

24-1508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

 0
RFQ
24-1508-31

Datasheet

 		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
714-43-228-31-018000

714-43-228-31-018000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
714-43-228-31-018000

Datasheet

 		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0508-T-11

HLS-0508-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

 0
RFQ
HLS-0508-T-11

Datasheet

 		HLS Bulk Active SIP 40 (5 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICA-628-ZHGT

ICA-628-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

 0
RFQ
ICA-628-ZHGT

Datasheet

 		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
126-93-320-41-002000

126-93-320-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
126-93-320-41-002000

Datasheet

 		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-420-41-002000

126-93-420-41-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
126-93-420-41-002000

Datasheet

 		126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-320-41-002000

126-43-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
126-43-320-41-002000

Datasheet

 		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-420-41-002000

126-43-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
126-43-420-41-002000

Datasheet

 		126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1924-T-R

APH-1924-T-R

APH-1924-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1024-T-R

APH-1024-T-R

APH-1024-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1124-T-R

APH-1124-T-R

APH-1124-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1724-T-R

APH-1724-T-R

APH-1724-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1224-T-R

APH-1224-T-R

APH-1224-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0224-T-R

APH-0224-T-R

APH-0224-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
614-87-124-13-041112

614-87-124-13-041112

CONN SOCKET PGA 124POS GOLD

Preci-Dip

 0
RFQ
614-87-124-13-041112

Datasheet

 		614 Bulk Active PGA 124 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
21-0503-21

21-0503-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

 0
RFQ
21-0503-21

Datasheet

 		0503 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
21-0503-31

21-0503-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

 0
RFQ
21-0503-31

Datasheet

 		0503 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
126-41-318-41-003000

126-41-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
126-41-318-41-003000

Datasheet

 		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-318-41-003000

126-91-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
126-91-318-41-003000

Datasheet

 		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
517-87-321-17-101111

517-87-321-17-101111

CONN SOCKET PGA 321POS GOLD

Preci-Dip

 0
RFQ
517-87-321-17-101111

Datasheet

 		517 Bulk Active PGA 321 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 625626627628629630631632...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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