Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 62 - Original source of goods

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
12-6810-90C CONN IC DIP SOCKET 12POS GOLD Aries Electronics	45	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	12 (2 x 6)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-
APA-640-T-B ADAPTER PLUG Samtec Inc.	100	-	RFQ	Datasheet	APA	Bulk	Active	-	40 (2 x 20)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
APA-640-G-A1 ADAPTER PLUG Samtec Inc.	98	-	RFQ	Datasheet	APA	Bulk	Active	-	40 (2 x 20)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
28-823-90C CONN IC DIP SOCKET 28POS GOLD Aries Electronics	7	-	RFQ	Datasheet	Vertisockets™ 800	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
299-93-628-10-002000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	56	-	RFQ	Datasheet	299	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
110-13-640-41-801000 CONN IC DIP SOCKET 40POS GOLD Mill-Max Manufacturing Corp.	30	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
APA-316-G-P ADAPTER PLUG Samtec Inc.	26	-	RFQ	Datasheet	APA	Tube	Active	-	16 (2 x 8)	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
40-516-11 CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics	20	-	RFQ	Datasheet	516	Bulk	Active	DIP, ZIF (ZIP)	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyamide (PA46), Nylon 4/6, Glass Filled	-
110-13-324-41-801000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	55	-	RFQ	Datasheet	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
209-PGM17020-10 CONN SOCKET PGA GOLD Aries Electronics	8	-	RFQ	Datasheet	PGM	Bulk	Active	PGA	-	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
2-2129710-8 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	34	-	RFQ	Datasheet	-	Tray	Active	LGA	3647	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Thermoplastic	-
256-1292-00-0602J CONN IC DIP SOCKET ZIF 56POS GLD 3M	13	-	RFQ	Datasheet	Textool™	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	56 (2 x 28)	0.070" (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
260-4204-01 CONN SOCKET QFN 60POS GOLD 3M	14	-	RFQ	Datasheet	Textool™	Bulk	Active	QFN	60 (4 x 15)	0.016" (0.40mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.016" (0.40mm)	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
ICO-314-STT CONN IC DIP SOCKET 14POS TIN Samtec Inc.	68	-	RFQ	Datasheet	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
123-83-314-41-001101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	30	-	RFQ	Datasheet	123	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
4590 CONN TRANSIST TO-5 3POS TIN Keystone Electronics	58	-	RFQ	Datasheet	-	Bulk	Active	Transistor, TO-5	3 (Round)	-	Tin	-	Brass	Chassis Mount	Closed Frame	Solder	-	Tin	-	Brass	Polyester, Glass Filled	-
APA-314-T-A1 ADAPTER PLUG Samtec Inc.	98	-	RFQ	Datasheet	APA	Bulk	Active	-	14 (2 x 7)	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-
299-83-308-10-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	47	-	RFQ	Datasheet	299	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
ICO-320-MTT .100" LOW PROFILE SCREW MACHINE Samtec Inc.	66	-	RFQ	Datasheet	ICO	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polyester, Glass Filled	-55°C ~ 105°C
XR2C-2015 CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div	43	-	RFQ	Datasheet	XR2	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C

Total 19086 Record«Prev 1... 58 59 60 616263 64 65...955 Next»