IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
222-3343-00-0602J

222-3343-00-0602J

CONN IC DIP SOCKET ZIF 22POS GLD

3M

16
RFQ
222-3343-00-0602J

Datasheet

Textool™ Tube Active DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
228-1290-00-0602J

228-1290-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

26
RFQ
228-1290-00-0602J

Datasheet

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
242-1281-00-0602J

242-1281-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M

25
RFQ
242-1281-00-0602J

Datasheet

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
228-4817-00-0602J

228-4817-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

35
RFQ
228-4817-00-0602J

Datasheet

Textool™ Bulk Active DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
242-1293-00-0602J

242-1293-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M

15
RFQ
242-1293-00-0602J

Datasheet

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
240-3639-00-0602J

240-3639-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

3M

17
RFQ
240-3639-00-0602J

Datasheet

Textool™ Bulk Active DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
220-7201-55-1902

220-7201-55-1902

CONN SOCKET SOIC 20POS GOLD

3M

23
RFQ
220-7201-55-1902

Datasheet

Textool™ Bulk Active SOIC 20 (2 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
242-1289-00-0602J

242-1289-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M

14
RFQ
242-1289-00-0602J

Datasheet

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
228-7396-55-1902

228-7396-55-1902

CONN SOCKET SOIC 28POS GOLD

3M

19
RFQ
228-7396-55-1902

Datasheet

Textool™ Bulk Active SOIC 28 (2 x 14) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
228-7474-55-1902

228-7474-55-1902

CONN SOCKET SOIC 28POS GOLD

3M

15
RFQ
228-7474-55-1902

Datasheet

Textool™ Bulk Active SOIC 28 (2 x 14) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
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