IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
2144-6315-9UA-1902

2144-6315-9UA-1902

GRID ZIP 15 X 15

3M

0
RFQ
2144-6315-9UA-1902

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 144 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
244A-6313-9UA-1902

244A-6313-9UA-1902

TEXTOOL

3M

0
RFQ
244A-6313-9UA-1902

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2108-6313-9UA-1902

2108-6313-9UA-1902

GRID ZIP 13 X 13

3M

0
RFQ
2108-6313-9UA-1902

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 108 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
284-6311-9UA-1902

284-6311-9UA-1902

GRID ZIP 11 X 11

3M

0
RFQ
284-6311-9UA-1902

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 84 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
224A-6313-9UA-1902

224A-6313-9UA-1902

TEXTOOL 13 X 13 PGA

3M

0
RFQ
224A-6313-9UA-1902

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2289-6317-9UA-1902

2289-6317-9UA-1902

GRID ZIP 17 X 17

3M

0
RFQ
2289-6317-9UA-1902

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 289 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2225-6315-9UA-1902

2225-6315-9UA-1902

GRID ZIP 15X15

3M

0
RFQ
2225-6315-9UA-1902

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
272-6311-9UA-1902

272-6311-9UA-1902

TEST BURN-IN PGA

3M

0
RFQ
272-6311-9UA-1902

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 72 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2180-6315-9UA-1902

2180-6315-9UA-1902

GRID ZIP 15 X 15

3M

0
RFQ
2180-6315-9UA-1902

Datasheet

Textool™ Bulk Discontinued at Digi-Key PGA, ZIF (ZIP) 180 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
2169-6317-9UA-1902

2169-6317-9UA-1902

PGA

3M

0
RFQ
2169-6317-9UA-1902

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
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