IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
290-1294-00-3302J

290-1294-00-3302J

CONN IC DIP SOCKET ZIF 90POS GLD

3M

0
RFQ
290-1294-00-3302J

Datasheet

Textool™ Bulk Active DIP, ZIF (ZIP) 90 (2 x 45) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
7010321946

7010321946

TEXTOOLTEST & BURN-IN BALL GRID

3M

0
RFQ
7010321946

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
249-930X-XX-2401

249-930X-XX-2401

CONN SOCKET BGA 49POS GOLD

3M

0
RFQ
249-930X-XX-2401

Datasheet

Textool™ - Obsolete BGA 49 (Verification Required) 0.039" (1.00mm) Gold - - Through Hole Closed Frame - - - - - - -
1011-1-0144-0B-00

1011-1-0144-0B-00

TEXTOOL1011-1-0144-0B-00

3M

0
RFQ
1011-1-0144-0B-00

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
1017-2-0256-0B-03

1017-2-0256-0B-03

TEXTOOLTEST & BURN-IN BALL GRID

3M

0
RFQ
1017-2-0256-0B-03

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
2196-9026-01-2401

2196-9026-01-2401

TEXTOOL 2196-9026-01-2401 BGA OP

3M

0
RFQ
2196-9026-01-2401

Datasheet

Textool™ Box Obsolete - - - - - - - - - - - - - - -
234-3034-01-0602

234-3034-01-0602

CONN ZIG-ZAG ZIF 34POS GOLD

3M

0
RFQ
234-3034-01-0602

Datasheet

Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 34 (1 x 34) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
7100285426

7100285426

TEXTOOLBURN-IN GRID ZIP SOCKETS

3M

0
RFQ
7100285426

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
2256-9020-00-2401

2256-9020-00-2401

3M TEXTOOL 2256-9020-00-2401 PP1

3M

0
RFQ
2256-9020-00-2401

Datasheet

Textool™ Bulk Obsolete - - - - - - - - - - - - - - -
235-3019-01-0602

235-3019-01-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M

0
RFQ
235-3019-01-0602

Datasheet

Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
Total 327 Record«Prev1... 1415161718192021...33Next»
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

ABOUT

ABOUT