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Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-93-428-41-105000

110-93-428-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
110-93-428-41-105000

Datasheet

 		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-628-41-105000

110-93-628-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
110-93-628-41-105000

Datasheet

 		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-428-41-105000

110-43-428-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
110-43-428-41-105000

Datasheet

 		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-628-41-105000

110-43-628-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
110-43-628-41-105000

Datasheet

 		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0922-T-R

APH-0922-T-R

APH-0922-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1922-T-R

APH-1922-T-R

APH-1922-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0222-T-R

APH-0222-T-R

APH-0222-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1722-T-R

APH-1722-T-R

APH-1722-T-R

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
116-93-316-41-008000

116-93-316-41-008000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
116-93-316-41-008000

Datasheet

 		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-316-41-008000

116-43-316-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
116-43-316-41-008000

Datasheet

 		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-2020-T-22

HLS-2020-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

 0
RFQ
HLS-2020-T-22

Datasheet

 		HLS Bulk Active SIP 400 (20 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
111-47-650-41-001000

111-47-650-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

 0
RFQ
111-47-650-41-001000

Datasheet

 		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-43-119-41-005000

317-43-119-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

 0
RFQ
317-43-119-41-005000

Datasheet

 		317 Bulk Active SIP 19 (1 x 19) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-41-316-41-001000

612-41-316-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

 0
RFQ
612-41-316-41-001000

Datasheet

 		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-316-41-001000

612-91-316-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

 0
RFQ
612-91-316-41-001000

Datasheet

 		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-632-41-605000

110-93-632-41-605000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
110-93-632-41-605000

Datasheet

 		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-632-41-605000

110-43-632-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
110-43-632-41-605000

Datasheet

 		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-6551-10

32-6551-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

 0
RFQ
32-6551-10

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-3554-10

32-3554-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

 0
RFQ
32-3554-10

Datasheet

 		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
44-6556-10

44-6556-10

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

 0
RFQ
44-6556-10

Datasheet

 		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
Total 19086 Record«Prev1... 580581582583584585586587...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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