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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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33-0501-30CONN SOCKET SIP 33POS TIN |
0 |
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Datasheet |
501 | Bulk | Active | SIP | 33 (1 x 33) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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317-93-108-41-005000SHRINK DIP SOCKET 8 PIN |
0 |
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- |
317 | Tube | Active | SIP | 8 (1 x 8) | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.070" (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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517-87-293-18-101111CONN SOCKET PGA 293POS GOLD |
0 |
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Datasheet |
517 | Bulk | Active | PGA | 293 (18 x 18) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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40-9513-11CONN IC DIP SOCKET 40POS GOLD |
0 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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110-13-322-41-001000CONN IC DIP SOCKET 22POS GOLD |
0 |
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Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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110-13-422-41-001000CONN IC DIP SOCKET 22POS GOLD |
0 |
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Datasheet |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
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26-81250-310CCONN IC DIP SOCKET 26POS GOLD |
0 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 26 (2 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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26-81250-610CCONN IC DIP SOCKET 26POS GOLD |
0 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 26 (2 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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26-8350-310CCONN IC DIP SOCKET 26POS GOLD |
0 |
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Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 26 (2 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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26-8530-310CCONN IC DIP SOCKET 26POS GOLD |
0 |
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Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 26 (2 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
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26-8900-310CCONN IC DIP SOCKET 26POS GOLD |
0 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 26 (2 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
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26-8975-310CCONN IC DIP SOCKET 26POS GOLD |
0 |
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Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 26 (2 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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26-8984-310CCONN IC DIP SOCKET 26POS GOLD |
0 |
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Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 26 (2 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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APH-0428-T-RAPH-0428-T-R |
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APH-1828-T-RAPH-1828-T-R |
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APH-0528-T-RAPH-0528-T-R |
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APH-1428-T-RAPH-1428-T-R |
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APH-1528-T-RAPH-1528-T-R |
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APH-1928-T-RAPH-1928-T-R |
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APH-0628-T-RAPH-0628-T-R |
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