IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-0722-T-T

APH-0722-T-T

APH-0722-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1622-T-T

APH-1622-T-T

APH-1622-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0322-T-T

APH-0322-T-T

APH-0322-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1722-T-T

APH-1722-T-T

APH-1722-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1222-T-T

APH-1222-T-T

APH-1222-T-T

Samtec Inc.

0
RFQ

-

* - Active - - - - - - - - - - - - - - -
124-41-310-41-002000

124-41-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
124-41-310-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-310-41-002000

124-91-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
124-91-310-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-13-310-41-001000

122-13-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
122-13-310-41-001000

Datasheet

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-11-624-41-001000

110-11-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

0
RFQ
110-11-624-41-001000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
110-11-324-41-001000

110-11-324-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
110-11-324-41-001000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-11-424-41-001000

110-11-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
110-11-424-41-001000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-1508-20

40-1508-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-1508-20

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
40-1508-30

40-1508-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0
RFQ
40-1508-30

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
605-93-314-11-480000

605-93-314-11-480000

SOCKET CARRIER LOWPRO .300 14POS

Mill-Max Manufacturing Corp.

0
RFQ
605-93-314-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
605-43-314-11-480000

605-43-314-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0
RFQ
605-43-314-11-480000

Datasheet

605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
22-0501-30

22-0501-30

CONN SOCKET SIP 22POS TIN

Aries Electronics

0
RFQ
22-0501-30

Datasheet

501 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
317-93-116-41-005000

317-93-116-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0
RFQ
317-93-116-41-005000

Datasheet

317 Tube Active SIP 16 (1 x 16) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-11-310-41-001000

123-11-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
123-11-310-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-41-632-41-105000

110-41-632-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
110-41-632-41-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-632-41-105000

110-91-632-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0
RFQ
110-91-632-41-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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