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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-41-316-41-006000

116-41-316-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
116-41-316-41-006000

Datasheet

 		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-316-41-006000

116-91-316-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
116-91-316-41-006000

Datasheet

 		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-322-41-001000

110-43-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
110-43-322-41-001000

Datasheet

 		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-306-41-002000

124-41-306-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
124-41-306-41-002000

Datasheet

 		124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-306-41-002000

124-91-306-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
124-91-306-41-002000

Datasheet

 		124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
410-91-220-10-001000

410-91-220-10-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

 0
RFQ
410-91-220-10-001000

Datasheet

 		410 Tube Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
410-91-220-10-002000

410-91-220-10-002000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

 0
RFQ
410-91-220-10-002000

Datasheet

 		410 Tube Active Zig-Zag, Right Stackable 20 (2 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-308-41-001000

116-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

 0
RFQ
116-93-308-41-001000

Datasheet

 		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-308-41-001000

116-43-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
116-43-308-41-001000

Datasheet

 		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-6556-10

32-6556-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 0
RFQ
32-6556-10

Datasheet

 		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
115-44-632-41-003000

115-44-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
115-44-632-41-003000

Datasheet

 		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-310-41-001000

614-93-310-41-001000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.

 0
RFQ
614-93-310-41-001000

Datasheet

 		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-310-41-001000

614-43-310-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 0
RFQ
614-43-310-41-001000

Datasheet

 		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0220-T-22-L

HLS-0220-T-22-L

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

 0
RFQ
HLS-0220-T-22-L

Datasheet

 		HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-0120-G-12

HLS-0120-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

 0
RFQ
HLS-0120-G-12

Datasheet

 		HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
315-93-120-41-003000

315-93-120-41-003000

SOCKET LOW PROFILE SIP 20POS

Mill-Max Manufacturing Corp.

 0
RFQ

-

 315 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
34-3503-20

34-3503-20

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

 0
RFQ
34-3503-20

Datasheet

 		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-3503-30

34-3503-30

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

 0
RFQ
34-3503-30

Datasheet

 		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-47-632-41-605000

110-47-632-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

 0
RFQ
110-47-632-41-605000

Datasheet

 		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
345444-4

345444-4

CONN SOCKET PGA 168POS GOLD

TE Connectivity AMP Connectors

 0
RFQ

-

 - Tube Obsolete PGA 168 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 3.00µin (0.076µm) Beryllium Copper Thermoplastic, Polyester -
Total 19086 Record«Prev1... 516517518519520521522523...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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