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Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
115-47-420-41-003000

115-47-420-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

 0
RFQ
115-47-420-41-003000

Datasheet

 		115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-7445-10

24-7445-10

CONN SOCKET SIP 24POS TIN

Aries Electronics

 0
RFQ
24-7445-10

Datasheet

 		700 Elevator Strip-Line™ Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-7500-10

24-7500-10

CONN SOCKET SIP 24POS TIN

Aries Electronics

 0
RFQ
24-7500-10

Datasheet

 		700 Elevator Strip-Line™ Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-6518-01

32-6518-01

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

 0
RFQ
32-6518-01

Datasheet

 		518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
84-PGM10003-10

84-PGM10003-10

CONN SOCKET PGA GOLD

Aries Electronics

 0
RFQ
84-PGM10003-10

Datasheet

 		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
84-PGM11009-10

84-PGM11009-10

CONN SOCKET PGA GOLD

Aries Electronics

 0
RFQ
84-PGM11009-10

Datasheet

 		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
84-PGM11010-10

84-PGM11010-10

CONN SOCKET PGA GOLD

Aries Electronics

 0
RFQ
84-PGM11010-10

Datasheet

 		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
84-PGM13053-10

84-PGM13053-10

CONN SOCKET PGA GOLD

Aries Electronics

 0
RFQ
84-PGM13053-10

Datasheet

 		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
614-41-308-31-007000

614-41-308-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 0
RFQ
614-41-308-31-007000

Datasheet

 		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-308-31-007000

614-91-308-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

 0
RFQ
614-91-308-31-007000

Datasheet

 		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-420-41-001000

110-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
110-43-420-41-001000

Datasheet

 		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-43-318-41-001000

210-43-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
210-43-318-41-001000

Datasheet

 		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210-93-318-41-001000

210-93-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

 0
RFQ
210-93-318-41-001000

Datasheet

 		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
268-5401-52-1102JH

268-5401-52-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

 0
RFQ
268-5401-52-1102JH

Datasheet

 		OEM Bulk Obsolete CLCC 68 (4 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
APH-1406-G-H

APH-1406-G-H

APH-1406-G-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1006-G-H

APH-1006-G-H

APH-1006-G-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0906-G-H

APH-0906-G-H

APH-0906-G-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1506-G-H

APH-1506-G-H

APH-1506-G-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-0606-G-H

APH-0606-G-H

APH-0606-G-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
APH-1106-G-H

APH-1106-G-H

APH-1106-G-H

Samtec Inc.

 0
RFQ

-

 * - Active - - - - - - - - - - - - - - -
Total 19086 Record«Prev1... 501502503504505506507508...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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