Leatech Electronics GmbH - IC Sockets - Sockets for ICs, Transistors - page 3 - Original source of goods

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
PLCC-32-AT-SMT PLCC SOCKET 32P SMT Adam Tech	4,007	-	RFQ	Datasheet	PLCC	Tube	Active	PLCC	32 (2 x 7, 2 x 9)	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
ICM-328-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 28P Adam Tech	789	-	RFQ	Datasheet	ICM	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
ICM-632-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 32P Adam Tech	988	-	RFQ	Datasheet	ICM	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
ICM-642-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 42P Adam Tech	305	-	RFQ	Datasheet	ICM	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	42 (2 x 21)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
PLCC-84-AT PLCC 84P THROUGH HOLE Adam Tech	522	-	RFQ	Datasheet	PLCC	Tube	Active	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
ICM-640-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 40P Adam Tech	217	-	RFQ	Datasheet	ICM	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
ICM-648-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 48P Adam Tech	729	-	RFQ	Datasheet	ICM	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)	-40°C ~ 105°C
PLCC-68-AT-SMT CONN SOCKET PLCC 68POS PHOS BRNZ Adam Tech	1,421	-	RFQ	Datasheet	PLCC	Tube	Active	PLCC	68 (4 x 17)	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
PLCC-52-AT PLCC 52P THROUGH HOLE Adam Tech	1,872	-	RFQ	Datasheet	PLCC	Tube	Active	PLCC	52 (4 x 13)	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C
PLCC-84-AT-SMT PLCC SOCKET 84P SMT Adam Tech	183	-	RFQ	Datasheet	PLCC	Tube	Active	PLCC	84 (4 x 21)	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 105°C

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