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Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
520-AG11D-ES

520-AG11D-ES

DIP SOCKET T/H 20POS

TE Connectivity AMP Connectors

 0
RFQ
520-AG11D-ES

Datasheet

 		500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
50950-0084N-002

50950-0084N-002

1.27MM PITCH WINBOND SOCKET CONN

Aces Connectors

 775
RFQ
50950-0084N-002

Datasheet

 		50950 Cut Tape (CT) Active PLCC 8 0.050" (1.27mm) Tin 80.0µin (2.03µm) Copper Alloy Surface Mount - Solder 0.050" (1.27mm) Tin 80.0µin (2.03µm) Copper Alloy Thermoplastic -
110-83-320-41-001101

110-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

 456
RFQ
110-83-320-41-001101

Datasheet

 		110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1-1825376-2

1-1825376-2

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

 0
RFQ
1-1825376-2

Datasheet

 		Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
1-1571552-0

1-1571552-0

CONN IC DIP SOCKET 32POS TIN

TE Connectivity AMP Connectors

 0
RFQ
1-1571552-0

Datasheet

 		800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
4-1571552-6

4-1571552-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

 0
RFQ
4-1571552-6

Datasheet

 		800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
346-93-109-41-013000

346-93-109-41-013000

CONN SOCKET SIP 9POS GOLD

Mill-Max Manufacturing Corp.

 175
RFQ
346-93-109-41-013000

Datasheet

 		346 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-308-T-A

APA-308-T-A

ADAPTER PLUG

Samtec Inc.

 0
RFQ
APA-308-T-A

Datasheet

 		APA Bulk Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-308-T-A

APO-308-T-A

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

 0
RFQ
APO-308-T-A

Datasheet

 		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
714-43-204-31-018000

714-43-204-31-018000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

 1,545
RFQ
714-43-204-31-018000

Datasheet

 		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
2-1571551-6

2-1571551-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

 0
RFQ
2-1571551-6

Datasheet

 		500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy Polyester -55°C ~ 125°C
824-AG31D-ES

824-AG31D-ES

CONN IC DIP SOCKET 24POS TINLEAD

TE Connectivity AMP Connectors

 0
RFQ
824-AG31D-ES

Datasheet

 		800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
516-AG10D-ES

516-AG10D-ES

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

 0
RFQ
516-AG10D-ES

Datasheet

 		500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
828-AG11D-ES

828-AG11D-ES

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

 0
RFQ
828-AG11D-ES

Datasheet

 		800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
9-1437539-1

9-1437539-1

828-AG11D-ES=SOCKET ASSY

TE Connectivity AMP Connectors

 1,245
RFQ
9-1437539-1

Datasheet

 		800 Box Active DIP, 0.1" (2.54mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole - Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
210-43-316-41-001

210-43-316-41-001

SOCKET 16-PIN .100" X .300" MACH

Mill-Max Manufacturing Corp.

 411
RFQ

-

 210 Box Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
SMPX-84LCC-P

SMPX-84LCC-P

SMT PLCC SOCKET 84P POLARISED RO

Kycon, Inc.

 195
RFQ
SMPX-84LCC-P

Datasheet

 		SMPX Tube Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
714-43-108-31-018000

714-43-108-31-018000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

 646
RFQ
714-43-108-31-018000

Datasheet

 		714 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
816-AG11D

816-AG11D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

 0
RFQ
816-AG11D

Datasheet

 		800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
1-1437540-7

1-1437540-7

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

 0
RFQ
1-1437540-7

Datasheet

 		800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
Total 19086 Record«Prev1... 3637383940414243...955Next»
Daily average RFQ Volume
1500+ Daily average RFQ Volume
Standard Product Unit
20,000.000 Standard Product Unit
Worldwide Manufacturers
1800+ Worldwide Manufacturers
In-stock Warehouse
15,000+ In-stock Warehouse
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